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Mastering Assembly Consistency with InFORMS® Solder Preforms
Manufacturing modern electronics often feels like a balancing act—literally. Assembly tilt and uneven coplanarity are persistent headaches that compromise solder joints, leading to weak connections
The Crystal That Solves AI’s Data Bottleneck – GGG
This is not a diamond. Can you believe this crystal contains gallium? Yes, this is a garnet crystal of gadolinium gallium, commonly called GGG, with the chemical formula Gd3Ga5O12. GGG crystals are
The Physics Behind Quantum Dots
The discussion below leans into technical language and uses terms commonly established in quantum mechanics and semiconductor physics. Quantum dots are one of the clearest real-world examples of
Understanding the Puzzle: A Summer in Marketing Communications
Looking back on my internship with Indium Corporation, one of the most significant lessons I’m taking with me is the importance of understanding how all the pieces of a team fit together. Long-term
Prueba de hipótesis para dos muestras
La profesora Patty Coleman estaba en su despacho de la Universidad Ivy reflexionando sobre una obviedad. Tanto ella como su marido Rob trabajaban en la Universidad Ivy, pero no podían permitirse enviar a sus hijos gemelos
Herramienta de softwareExcel® para realizar pruebas de hipótesis en datos SMT
La profesora Patty Coleman, de la Universidad Ivy, estaba en el restaurante Simon Pearce, almorzando sola y relajándose mientras contemplaba la hermosa cascada del restaurante. Mientras disfrutaba de su plato estrella...
Comprender los fallos en la resistencia de aislamiento superficial: defectos clave que provocan fallos en las pruebas
En lo que respecta a la fiabilidad de los componentes electrónicos, las pruebas de resistencia de aislamiento superficial (SIR) son una de las medidas de seguridad más importantes, aunque a menudo se pasan por alto. Los fallos en las pruebas SIR pueden provocar pérdidas en las misiones.
Materiales térmicos innovadores para procesadores GPU para servidores con IA y ASIC con chips sin encapsular.
Innovadores TIM metálicos para procesadores AI/GPU A medida que evolucionan las tecnologías de inteligencia artificial (AI) y computación de alto rendimiento (HPC), sus demandas computacionales se han disparado, lo que ha llevado a un
Soluciones Au-mazing: cómoAuLTRA® MediPro se encuentra en el «corazón» de los dispositivos médicos implantables
Cuando la gente piensa en los avances en tecnología médica, piensa en cosas como robots que ayudan en cirugías, diagnósticos con inteligencia artificial o neuroestimuladores, como el «Blindsight» de Neuralink.
El papel de la formación intermetálica y las acumulaciones de metalización comunes para los TIM de soldadura
No es ningún secreto que los materiales de interfaz térmica (TIM) de indio y soldadura de indio-plata muestran un gran potencial para maximizar el rendimiento térmico en la informática de alto rendimiento (HPC) y la IA.
The Bismuth Solder Guide: Why and When to Use It
In our previous guide, we introduced the world of low-temperature soldering and its growing importance in modern electronics assembly. Now, we will take a deeper dive into one of the key enabling
The Ultimate Guide to Low-Temperature Soldering
In electronics assembly, the soldering process is fundamental to creating reliable connections. Traditionally, this involves high reflow temperatures, often exceeding 240°C. However, as components
TIM para soldadura: Descifrando TIM1 frente a TIM1.5 para el embalaje avanzado
Computing power is surging across high-performance markets like AI, data centers, HPC, and automotive power electronics. As devices push the boundaries of performance, managing heat becomes a
Formic Acid Soldering Technology (FAST) Paste: The New Frontier in Fluxless Soldering
In my previous blog post on formic acid soldering, I explained the technology of formic acid reflow soldering, the applications in which it can be beneficial over traditional reflow soldering, the
Understanding Indium Oxidation and Its Impact on Precision Applications
Indium oxidation is not merely a surface phenomenon—it plays a critical role in the performance and reliability of high-precision applications, including semiconductors, AI, high-performance
Formic Acid Reflow Soldering: The New Technology that is Clean, Reliable, and Power Ready
At Indium Corporation, we understand the challenges related to power electronics assembly; devices are increasing in complexity, while demands on performance and reliability grow stronger. On top of
New StencilCoach Add In to Calculate Apertures to Minimize Solder Balling
Folks, The creation of solder balls, when assembling passive discrete components, has been an issue for decades (see Figure 1). The discovery that the “home plate” stencil aperture design
Au-mazing Solutions: How AuLTRA® Fine Wire Brings Gold Standard Precision to Medical Devices
In the world of medical device manufacturing, where reliability and precision are critical, materials used in the assembly must meet the highest
Mastering Solder Preform Technology With Low Temperature Solder Alloy Solutions
Achieving efficiency, reliability, and exceptional thermal performance is crucial in package-attach soldering applications for power modules. However, the high reflow temperatures required by
El auge de la pasta sinterizada de cobre
A little over a year ago, I posted about the increase in interest regarding Cu sintering. In the past 12 months, that interest has surged, highlighting Cu sintering’s suitability for various
Wave Soldering and 4 Nations Hockey: A Unique Comparison
With the 4 Nations Face-Off hockey tournament held just recently in Canada and Boston, Massachusetts gained a lot of publicityfor its intensity and high level of play, and arguably pushed the NHL to
















