October 2, 2006
Indium Corporation was recognized with the Global Technology Award for its Indium5.1AT Pb-Free Solder Paste. Sponsored by Global SMT & Packaging magazine, the award acknowledges outstanding innovations in the printed circuit assembly and packaging industries. It was presented at Assembly Technology Expo in Rosemont, Illinois USA.
Indium5.1AT is an air reflow, no-clean solder paste that provides increased finished goods reliability when compared to competitive solder pastes. It features ultra low voiding (in the 5% range) when soldering BGAs with micro via-in-pad designs. No other solder paste is known to exceed this level of performance.
In addition, Indiumt5.1AT was specifically formulated to minimize the impact of downtime on printed deposit volumes, ensuring a consistently high reliability on board assembly. This gives customers increased reliability while at the same time saving them money.
To learn more about Indium5.1AT click here.
Indium Corporation is a four-time Frost & Sullivan Award-winning supplier of electronics assembly materials, including solder pastes, solder preforms, fluxes, Pb-Free solder alloys, underfill materials, die-attach materials, and more. The company is also the world’s premiere supplier of commercial grade and high-purity indium. Factories are located in North America, Europe, and Asia. Founded in 1934, the company is ISO-9001 registered.
For more information about Indium Corporation visit www.indium.com or email [email protected].
