Corporate Communications

Webinar Archive Library

Indium Corporation’s InSIDER Series is a free webinar program designed to help you enjoy technical content from any location.
Reflow 101 from a Solder Manufacturer’s Perspective – Session II web logo
Reflow 101 from a Solder Manufacturer’s Perspective – Session II
February 16, 2021
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Presenter: Kim Flanagan, CSMTPE

Soldering defects in SMT can arise from three main areas: the design, the materials, and the process. Identifying the root cause and troubleshooting these defects can be timely and expensive.

Reflow 101 from a Solder Manufacturer’s Perspective – Session I web logo
Reflow 101 from a Solder Manufacturer’s Perspective – Session I
February 10, 2021
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Presenter: Kim Flanagan, CSMTPE

Soldering defects in SMT can arise from three main areas: the design, the materials, and the process. Identifying the root cause and troubleshooting these defects can be timely and expensive.

Ultrafine Solder Paste Dispensing for Heterogeneous Integration web logo
Ultrafine Solder Paste Dispensing for Heterogeneous Integration
January 26, 2021
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Presenter: Kenneth Thum

Miniaturization has been, and continues to be, a challenge for the electronics industry. Assemblies are getting more complex and component spacing is steadily decreasing. With more dies and components packed into smaller footprints, the need for heterogeneous integration for advanced packaging is getting greater.

The Evolution of Lead-Free Solder Alloys web logo
The Evolution of Lead-Free Solder Alloys
January 19, 2021
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Presenter: Hongwen Zhang

When the world was moving toward green manufacturing, lead-free soldering – originally driven by RoHS (Restriction on the use of Hazardous Substances in electrical and electronic equipment) of Europe – was becoming the mainstream for the electronics industry, and Sn-rich alloys – including SnAgCu, SnAg, and SnCu – have been prevailing for more than a decade.

Soldering Material Evolution for Heterogeneous Integration Assembly web logo
Soldering Material Evolution for Heterogeneous Integration Assembly
November 11, 2020
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Presenter: Sze Pei Lim

The development of heterogeneous integration, which packs more dies or components into a smaller footprint, requires multiple technological advancements in various aspects of advanced packaging, such as substrate design, interconnect methods, and materials.

5G Base Station Introduction: Soldering Challenges and Solutions web logo
5G Base Station Introduction: Soldering Challenges and Solutions
November 10, 2020
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Presenter: Foo Siang Hooi

5G networks began rolling out in 2018. Although the technology is still in its early stages, it is expected that the networks will become faster and connect even more devices than now. The networks are powered by 5G base stations which include active antenna units (AAU), antennas, remote radio units (RRU), and base band units (BBU).

DFx on High Density Assemblies web logo
DFx on High Density Assemblies
October 13, 2020
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Presenter: Jonas Sjoberg

Implementing high-density assembly in all electronic products requires a lot of considerations. Before starting any development work or implementing a new technology, it is critical to understand the product and industry requirements and capabilities; if this is not fully understood, failure is the most probable outcome.

Entendiendo y solucionando el defecto de voids en componentes BTCs (QFNs) web logo
Entendiendo y solucionando el defecto de voids en componentes BTCs (QFNs)
September 22, 2020
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Presenter: Ivan Castellanos

Los BTCs (Bottom Terminated Components) son componentes cada vez más comunes en la industria electrónica actual y con tendencia a incrementarse debido a su tamaño pequeño, excelente desempeño eléctrico y su habilidad de transferir el calor fuera del circuito integrado (IC).

PCB and Component Warpage Defects: HiP/HoP and Non-Wet Opens – Causes and Solutions web logo
PCB and Component Warpage Defects: HiP/HoP and Non-Wet Opens – Causes and Solutions
September 9, 2020
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Presenter: Bob Willis

Heating PCBs for soldering can cause the substrate and components to potentially warp. This can cause parts to expand and contract, leading to common soldering defects such as HiP/HoP and non-wet opens.

Solder Attributes & Impact on Increased Product Reliability Requirements of Electronic Assemblies web logo
Solder Attributes & Impact on Increased Product Reliability Requirements of Electronic Assemblies
September 2, 2020
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Presenter: Andreas Karch

The reliability specifications for the product lifetime validation of electronic assemblies are increasing due to the changing requirements of duration of use (increased cycles) as well as increased service temperatures (125-200°C). 

Innovations in Liquid Metal Thermal Interface Materials web logo
Innovations in Liquid Metal Thermal Interface Materials
August 27, 2020
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Presenter: Miloš Lazić

Gallium-based liquid metal has been used as a thermal interface material (TIM) in niche applications for years. 

Ask the Intern: A Q&A Session with Indium Corporation’s Summer Interns web logo
Ask the Intern: A Q&A Session with Indium Corporation’s Summer Interns
August 6, 2020
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Presenter: Joy Valencia

Indium Corporation’s summer internship program is not your average internship. And, to truly understand the unique experience, who better to ask than the interns themselves?

 

 

5G Connectivity: Challenges and Gold Solutions web logo
5G Connectivity: Challenges and Gold Solutions
August 5, 2020
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Presenter: Jenny Gallery

As a successor to 4G, the 5G connectivity network is sure to not only transform technology as we know it, but also provide an entirely new mobile experience for every user. 

Cleaning No Cleans Doesn't Have to be a Dirty Job web logo
Cleaning No Cleans Doesn't Have to be a Dirty Job
August 4, 2020
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Presenter: Brian O’Leary of Indium Corporation, Debbie Carboni of Kyzen

There are very good reasons why the industry continues to use no-clean solder paste. However, there are also equally good reasons why a no-clean solder paste may still need additional cleaning. 

What's Driving: Automotive Electronics Assembly and Packaging  web logo
What's Driving: Automotive Electronics Assembly and Packaging
July 28, 2020
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Presenter: Andy Mackie, PhD, MSc

The evolution of the automobile over the past decade has been faster than ever before, and the 2020s promise even more rapid progress. The changes we will all experience include the nature of car ownership, how the car is powered, increased safety, and driver automation.

Innovación en soldadura de baja temperatura – Durafuse™ LT y el rango de baja a media te web logo
Innovación en soldadura de baja temperatura – Durafuse™ LT y el rango de baja a media te
July 21, 2020
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Presenter: Ivan Castellanos

En soldadura de baja temperatura, no existe una aleación que cumpla con todos los requerimientos. La temperatura real o actual para condiciones de “baja temperatura” puede tener un rango muy amplio. 

 

Power Electronics: Improve Bondline Control & Reliability with Reinforced Matrix Preforms web logo
Power Electronics: Improve Bondline Control & Reliability with Reinforced Matrix Preforms
June 23, 2020
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Presenter: Karthik Vijay

Due to increasing electrification, especially in automotive power modules and RF communication, it is clear that uniform bondline control between the substrate and baseplate has a direct link to mechanical reliability. 

Voiding Workshop: Understand and troubleshoot voiding in bottom terminated components (BTCs) web logo
Voiding Workshop: Understand and troubleshoot voiding in bottom terminated components (BTCs)
June 11, 2020
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Presenter: Dr. Ron Lasky

Bottom terminated components (BTCs) are one of the most common packages in electronics today with the highest growth rate due to their small size, excellent electrical performance, and ability to transfer heat away from the integrated circuit (IC).

Optimization of the Robotic Soldering Process: A Focus on Solder Spread and Spattering web logo
Optimization of the Robotic Soldering Process: A Focus on Solder Spread and Spattering
May 21, 2020
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Presenter: Robert McKerrow

Adoption of robotic soldering is growing within the PCB Assembly industry. This method is more efficient than hand soldering, so it aids in alleviating human mistakes. 

Low-Temperature Solder Innovation — Durafuse™ LT and the Low to Mid-Temperature Space  web logo
Low-Temperature Solder Innovation — Durafuse™ LT and the Low to Mid-Temperature Space
May 13, 2020
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Presenter: Claire Hotvedt

Low temperature soldering is not a one alloy fits all situation. The actual temperature required for “low temperature” applications can vary widely.

DPAK Voiding: A Study to Determine the Origins of DPAK Voiding web logo
DPAK Voiding: A Study to Determine the Origins of DPAK Voiding
April 28, 2020
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Presenter: Kim Flanagan

Indium Corporation’s Kim Flanagan, Technical Support Engineer for Engineered Solder Materials, will host a webinar on liquid metal thermal interface materials.

View our list of upcoming webinars