Corporate Communications

Webinar Archive Library

Indium Corporation’s InSIDER Series is a free webinar program designed to help you enjoy technical content from any location.
EV InSIDER Logo Header
EV Survivor: Which of the EV Startups Will Live or Die? web logo
EV Survivor: Which of the EV Startups Will Live or Die?
With the global transition to vehicle electrification moving into high gear, hundreds and hundreds of startups are chasing what is one of the largest business opportunities in the last 100 years. From electric vehicle OEMs such as Rivian, Lucid Motors, and Fisker, to battery startups such as Solid Power, ONE, and QuantumScape, or EV charging companies such as Volta, WiTricity, and EVgo, there will likely be more losers than winners in this race for market and mindshare. More

With the global transition to vehicle electrification moving into high gear, hundreds and hundreds of startups are chasing what is one of the largest business opportunities in the last 100 years. From electric vehicle OEMs such as Rivian, Lucid Motors, and Fisker, to battery startups such as Solid Power, ONE, and QuantumScape, or EV charging companies such as Volta, WiTricity, and EVgo, there will likely be more losers than winners in this race for market and mindshare.

In this webcast, Alexa St. John, auto reporter for Business Insider who specializes in covering EV industry startups, will share her thoughts on the headwinds facing many of these startups and who some of the most likely survivors and next unicorn companies will be. Hosts Brian O’Leary and Loren McDonald will dive into key topics with Alexa including:

  • What are the key hurdles and challenges facing these startups in today’s challenging economic and supply-chain constrained environment?
  • What are the profiles, traits, and signs of success that companies in the EV space have that will most likely determine whether they die, survive, or thrive this decade?
  • Which EV startups among the current crop will survive? Who has the capital, team, backing, supply-chain relationships to pull it off? Who is in trouble? And who are some of the sleeper companies in the EV battery and charging space?
Less
Statistical Process Control (SPC) 101 web logo
Statistical Process Control (SPC) 101
November 8, 2022 Presenter: Ron Lasky, Ph.D., PE, Senior Technologist

This Insider Series Webinar will cover statistical process control (SPC). SPC is an important tool in controlling SMT assembly processes, especially stencil printing. 

The webinar will start with a discussion of the 6 Ms of variation and then delineate common cause and special cause variation. The difference between precision and accuracy will then be clarified. After discussing the precision tolerance ratio, the technique to perform a Gage R&R (Repeatability and Reproducibility) analysis will be presented. Process control charts, and their development by Walter Shewhart, will then be discussed including the Shewhart Rules. Several sets of SPC Xbar-R and C Chart data will then be plotted and analyzed with Minitab®. A 30 day trial version of Minitab is available for free.

More

This Insider Series Webinar will cover statistical process control (SPC). SPC is an important tool in controlling SMT assembly processes, especially stencil printing. 

The webinar will start with a discussion of the 6 Ms of variation and then delineate common cause and special cause variation. The difference between precision and accuracy will then be clarified. After discussing the precision tolerance ratio, the technique to perform a Gage R&R (Repeatability and Reproducibility) analysis will be presented. Process control charts, and their development by Walter Shewhart, will then be discussed including the Shewhart Rules. Several sets of SPC Xbar-R and C Chart data will then be plotted and analyzed with Minitab®. A 30 day trial version of Minitab is available for free.

The webinar will conclude with a discussion and application of the process capability indices Cp and Cpx

SPC 101 Topics Covered:

  • The 6 Ms of variation
  • Special Cause and Common Variation
  • Measuring as a Process
  • Precision and Accuracy
  • Precision/Tolerance Ratio
  • Gage R&R (Repeatability & Reproducibility) Analysis
  • Control Charts- Shewhart Rules
  • Xbar R Charts
    • Stencil Printing Example
  • C Charts
  • Pareto Charts
  • Cp and Cpk with Examples
  • Minitab will be used throughout
Less
EV InSIDER Logo Header
Managed Charging and Vehicle-to-Grid: Reality or a Distant Dream? web logo
Managed Charging and Vehicle-to-Grid: Reality or a Distant Dream?
October 13, 2022 Co-Hosts: Apoorv Bhargava, CEO and Co-founder of WeaveGrid, Brian O’Leary, Global Accounts Manager, Global Head e-Mobility & Infrastructure, Loren McDonald, Electric Vehicle (EV) Analyst at EVAdoption

With the number of EVs on the road in the US expected to reach nearly 40 million in 2030 from roughly 2.7 million today, several questions have emerged around whether our regional grids will be able to support this growth in demand and load.

More

With the number of EVs on the road in the US expected to reach nearly 40 million in 2030 from roughly 2.7 million today, several questions have emerged around whether our regional grids will be able to support this growth in demand and load.

In California for example, modeling from the Energy Innovation Policy & Technology research firm shows electricity demand could grow 18% from 2020 levels by 2030, as vehicles and buildings electrify. But because EVs are essentially storage batteries on wheels and most passenger vehicles sit parked 22 or more hours per day, they have the huge potential to help stabilize the grid rather than bring it down.

In this webcast, Apoorv Bhargava, expert on the grid and EVs and CEO/co-founder of WeaveGrid, a software company that builds data products to enable increased adoption of electric vehicles, will share his thoughts on how the role of emerging techniques such as managed charging, vehicle-to-grid and vehicle-to-home will play out this decade. Hosts Brian O’Leary and Loren McDonald will dive into key topics with Apoorv including:

  • What we learned about EVs and the grid from the recent threat of blackouts in California
  • The role of managed charging as a key tool in utilities’ toolbox to minimize the load impact of EVs during high demand times of the day.
  • The promise of vehicle-to-grid, vehicle-to-home and vehicle-to-building to feed power to the grid or minimize the need for additional power generation.
Less
Relion Logo Header
Driving e-Mobility: Rel-ion™: Best Practices For SMT Assembly & Root Cause Analysis web logo
Driving e-Mobility: Rel-ion™: Best Practices For SMT Assembly & Root Cause Analysis
This webinar will focus on optimizing two of the most important areas of the SMT assembly process, printing & reflow. To obtain a high yield process with a low defect rate, both the printing and reflow process must be fully understood and finetuned to work with the materials being used for assembly. More

This webinar will focus on optimizing two of the most important areas of the SMT assembly process, printing & reflow. To obtain a high yield process with a low defect rate, both the printing and reflow process must be fully understood and finetuned to work with the materials being used for assembly. In this seminar Sbiroli will discuss:

  • Printed circuit board assembly (PCBA) material’s selection & optimization (solder paste & board design)
  • Proper storage & handling techniques
  • Stencil selection
  • Stencil printer setup
  • Common solder paste printing defects & how to overcome
  • Designing a reflow profile for low voiding & high reliability
  • Understanding & mitigation of common reflow related defects including voiding, head-in-pillow (HiP), non-wet opens (NWO), graping & tombstoning

A question & answer session will be held at the end of the presentation. Please bring your SMT process challenges to discuss with the presenter. Sbiroli has almost 30 years’ experience related to SMT materials & process optimization.

Less
Relion Logo Header
Driving e-Mobility: Rel-ion™: Design Considerations for Board Layout & Material Selection web logo
Driving e-Mobility: Rel-ion™: Design Considerations for Board Layout & Material Selection web logo
Driving e-Mobility: Rel-ion™: Design Considerations for Board Layout & Material Selection

In Design Considerations for Board Layout and Material SelectionSjoberg and Marques will discuss how implementing high-density SMTA assemblies in electronic products require many considerations. Previously, high-density SMTA assemblies were primarily used in mobile phones and consumer electronics.

More

In Design Considerations for Board Layout and Material SelectionSjoberg and Marques will discuss how implementing high-density SMTA assemblies in electronic products require many considerations. Previously, high-density SMTA assemblies were primarily used in mobile phones and consumer electronics. However, the rapid growth of EVs and more sophisticated electronics on all types of automobiles shows that these high-density assemblies are not being fully adapted into the automotive market. Before starting any developmental work or implementing a new technology, it is critical to understand the products, their capabilities, and industry requirements. If these are not fully understood, failure is the most probable outcome.


This presentation will discuss conducting DfX based on end-product requirements and the need to perform proper root cause analyses before making any material or process changes.

Less
Flip-Chip 101 web logo
Flip-Chip 101
September 15, 2022 Presenter: Presenter: Evan Griffith, Product Specialist

Flip-Chip bonding technology has a long history, stemming from its inception by General Electric in (curiously) Indium Corporation’s hometown of Utica, New York. As such, the term “flip-chip” has evolved to encompass a wide variety of bonding technologies which solve various bonding challenges. However, in the most basic sense of the term, flip-chip bonding defines the bonding process in which the circuitry of a chip is manufactured face-down and flipped to be attached to a substrate.

More

Flip-Chip bonding technology has a long history, stemming from its inception by General Electric in (curiously) Indium Corporation’s hometown of Utica, New York. As such, the term “flip-chip” has evolved to encompass a wide variety of bonding technologies which solve various bonding challenges. However, in the most basic sense of the term, flip-chip bonding defines the bonding process in which the circuitry of a chip is manufactured face-down and flipped to be attached to a substrate.

In this webinar, the history of flip-chip technology, and the trends which have caused the manufacturing process to evolve will be discussed. Common failure modes in flip-chip assembly will also be touched on, as well as how material advancements have allowed for and will continue to push new technology in flip-chip bonding.

Less
EV InSIDER Logo Header
Are Utilities Ready for the EV Revolution? web logo
Are Utilities Ready for the EV Revolution?
September 8, 2022 Co-Hosts: Brian O’Leary, Global Accounts Manager, Global Head e-Mobility & Infrastructure, Kevin Hernandez, Loren McDonald, Electric Vehicle (EV) Analyst at EVAdoption
By 2030, electric vehicles (EVs) are expected to reach nearly 40 million vehicles on the road in the US and around 12% of all vehicles. This growth in EVs will demand a significant increase in charging infrastructure where people live, work, shop, and travel to — and the utility backbone of power generation, grid transmission, and local distribution. More

By 2030, electric vehicles (EVs) are expected to reach nearly 40 million vehicles on the road in the US and around 12% of all vehicles. This growth in EVs will demand a significant increase in charging infrastructure where people live, work, shop, and travel to — and the utility backbone of power generation, grid transmission, and local distribution.

In this webcast, utility consultant and expert Kevin Hernandez of consulting firm ScottMadden, will share his thoughts on what he believes is the utility industry’s biggest business opportunity in 100 years — but also its largest challenge of which to take advantage. Hosts Brian O’Leary and Loren McDonald will dive into key topics with Kevin including:

  • The utility and public utility commission regulatory framework that can make it difficult for utilities to respond quickly to market changes
  • EV charging infrastructure, battery storage, vehicle to grid, smart charging, and more are significant opportunities for utilities in the future — which market opportunities are they likely to lead versus follow?
  • Supplying power to residential and commercial customers is all about data. How will utilities leverage their existing customer relationships and data analytics to best manage and monetize the expected explosive growth in power demand from EV charging infrastructure.
Less
DOEs 201: Screening and Reduced Designs web logo
DOEs 201: Screening and Reduced Designs
August 30, 2022 Presenter: Ron Lasky, Ph.D., PE, Senior Technologist
A short time ago we covered DOE 101, the basics of Design of Experiments in an Insider Series Webinar You can watch this webinar here. DOE 201 is a follow on Insider Series Webinar on advanced DOE techniques, mostly what are called screening and reduced designs. Screening designs are performed when there are so many factors to analyze that performing a DOE with all of the factors at a high number of factor levels is not practical. More

A short time ago we covered DOE 101, the basics of Design of Experiments in an Insider Series Webinar You can watch this webinar here. DOE 201 is a follow on Insider Series Webinar on advanced DOE techniques, mostly what are called screening and reduced designs. Screening designs are performed when there are so many factors to analyze that performing a DOE with all of the factors at a high number of factor levels is not practical. As an example, suppose there is a DOE with 6 factors, each at 4 levels. This DOE would require at least 46 = 4096 runs. 

In cases like this one, screening experiments are often performed to determine which factors are important. In a screening experiment, each factor is only evaluated at two levels. So in this case the number of data points, or runs, required is only 26 = 64. In some cases, it is possible to reduce the number of runs further by employing a fractional factorial design.

This webinar will discuss how to perform these screening and fractional factorial DOEs and the risks in doing so. In the webinar, several screening and fractional factorial DOEs will be analyzed with Minitab. The data will be given to the attendees so that they can practice on their own. A 30 day trial version of Minitab is available for free. 

Less
EV InSIDER Logo Header
US Charging 2.0: Building a More Reliable Public Experience web logo
US Charging 2.0: Building a More Reliable Public Experience
August 11, 2022 Co-Hosts: Cory Bullis, Brian O'Leary, Global Accounts Manager, Global Head e-Mobility & Infrastructure,, Loren McDonald, Electric Vehicle (EV) Analyst at EVAdoption

Almost half of US households do not have the option to charge at home, making reliable public charging options critical for our electric vehicle future. Today, our existing charging network is unfortunately receiving a failing grade.  We will discuss the new US standards for uptime performance and how the industry can best respond while also delivering to the public an A+ experience.

Co-hosted by Loren McDonald and Brian O'Leary. With featured guest Cory Bullis.

More

Almost half of US households do not have the option to charge at home, making reliable public charging options critical for our electric vehicle future. Today, our existing charging network is unfortunately receiving a failing grade.  We will discuss the new US standards for uptime performance and how the industry can best respond while also delivering to the public an A+ experience.

Co-hosted by Loren McDonald and Brian O'Leary. With featured guest Cory Bullis.

Less
EV InSIDER Logo Header
The EV Revolution: Past, Present, and Future featuring Chelsea Sexton web logo
The EV Revolution: Past, Present, and Future featuring Chelsea Sexton
The EV Revolution: Past, Present, and Future, features guest Chelsea Sexton. Sexton helped launch the EV-1, was a consulting producer for Who Killed the Electric Car, co-founded Plug-In America, and has held several EV consulting and advisory roles... More
The EV Revolution: Past, Present, and Future, features guest Chelsea Sexton. Sexton helped launch the EV-1, was a consulting producer for Who Killed the Electric Car, co-founded Plug-In America, and has held several EV consulting and advisory roles. She will help O’Leary and McDonald put the last two and a half decades—and the coming decade—of electric vehicle development into perspective. They’ll explore the excitement of the early 1990s through the launch of the Nissan LEAF and Chevrolet Volt. Sexton will also share her perspective on the state of EV charging infrastructure, what she sees as key for EVs to go mainstream, and if the industry will experience a turning point similar to when Apple launched the iPhone. Less
Relion Logo Header
Driving e-Mobility: Rel-ion™: Increased Reliability for Higher Mission Profiles in Automotive Electronics web logo
Driving e-Mobility: Rel-ion™: Increased Reliability for Higher Mission Profiles in Automotive Electronics
Increased Reliability for Higher Mission Profiles in Automotive Electronics,Enhanced automotive electrification has resulted in increased mission profiles (more cycles, higher service temperatures) for PCB assemblies as well as power modules (for inverters)... More
Increased Reliability for Higher Mission Profiles in Automotive Electronics,Enhanced automotive electrification has resulted in increased mission profiles (more cycles, higher service temperatures) for PCB assemblies as well as power modules (for inverters). The solder joints experience greater thermo-mechanical loads and there will be instances where traditional SAC solder alloys may not be able to fulfill more stringent product lifetime validation requirements. Therefore, the choice of solder materials becomes more critical as they have to check multiple design requirements – (a) increased hardness to compensate for creep under stress with increased temperatures; (b) balancing hardness with the right amount of ductility so as to not transmit the stress elsewhere; (c) ensuring that the alternate solder alloy can be processed in the same window used for SAC solders. Less
Are You a Candidate for SMTA Certification? web logo
Are You a Candidate for SMTA Certification?
This webinar will review some of the topics that are covered in SMTA Certification. It will be presented by Professor Ron Lasky, Ph.D., PE, a co-founder of the SMTA Certification Program. More

This webinar will review some of the topics that are covered in SMTA Certification. It will be presented by Professor Ron Lasky, Ph.D., PE, a co-founder of the SMTA Certification Program. The webinar will start with a review of 10 short-answer questions that certification candidates are expected to know coming into the exam preparation course. A review of the exam preparation course will then be given. The webinar will then review three potential calculation problems that might be on the exam:

  1. How to design a stencil.
  2. How to match a reflow profile to a solder paste spec.
  3. How to determine the belt speed on a reflow oven for the required throughput.

At the end, the attendees will have a sense of what the exam preparation course and the exam itself are like.

Less
Relion Logo Header
Driving e-Mobility: Rel-ion™: Voiding Mechanisms & Solutions For High Density Automotive Electronics web logo
Driving e-Mobility: Rel-ion™: Voiding Mechanisms & Solutions For High Density Automotive Electronics
Since the early days of SMT assembly, one of the most persistent defects with the greatest longevity is voiding in solder joints. Other defects – such as graping, head-in-pillow, and non-wet opens – have known solutions, but voiding remains largely unsolved and with each technology inflection seems to make a strong comeback. More
Since the early days of SMT assembly, one of the most persistent defects with the greatest longevity is voiding in solder joints. Other defects – such as graping, head-in-pillow, and non-wet opens – have known solutions, but voiding remains largely unsolved and with each technology inflection seems to make a strong comeback. The increased use of bottom-terminated components (BTC), high-density electronics, and high-reliability alloys needed for today’s automotive applications has resulted in a renewed focus on voiding reduction. Voiding in solder bumped components (e.g., BGAs and CSPs) and BTCs (including QFNs and DPAK) each have their own unique cause and mitigation techniques. To consistently maintain an acceptable level of voiding per industry standards and self-imposed levels due to stringent in-use requirements, a detailed understanding of the unique causes of voiding and process mitigation techniques is needed. This session will review the cause and effect relationship between voiding and the soldering materials used in today’s electronics assemblies. We will also review material and process solutions to maintain acceptable levels of voiding in various forms of SMT assembly. Less
Design of Experiments (DOE) for SMT 101 web logo
Design of Experiments (DOE) for SMT 101
Design of Experiments (DOE) is an extremely important tool in electronic assembly to optimize assembly processes. This webinar, Ron Lasky, Ph.D., PE, will present a practical approach to understanding and performing DOEs. It will start with a layman’s perspective of analysis of variance (ANOVA), the statistical technique that is employed in DOEs. More
Design of Experiments (DOE) is an extremely important tool in electronic assembly to optimize assembly processes. This webinar, Ron Lasky, Ph.D., PE, will present a practical approach to understanding and performing DOEs. It will start with a layman’s perspective of analysis of variance (ANOVA), the statistical technique that is employed in DOEs. A simple DOE will then be performed by hand so that the attendee can have a basic understanding of the math involved. The webinar will conclude with the analysis of a DOE to optimize stencil printing. The DOE will be performed with Minitab®. A thorough discussion of the results will be given. The data will be available for attendees to perform the Minitab® analysis on their own after the webinar. Less
Solder Challenges and Product Development with Durafuse™ Technology web logo
Solder Challenges and Product Development with Durafuse™ Technology
In this webinar of Solder Challenges and Product Development with Durafuse™ Technology, Dr. Zhang will discuss the basic shortcomings of traditional solder materials and will examine the ability of Indium Corporation’s Durafuse™ technology to provide a solution to these challenges. More
In this webinar of Solder Challenges and Product Development with Durafuse™ Technology, Dr. Zhang will discuss the basic shortcomings of traditional solder materials and will examine the ability of Indium Corporation’s Durafuse™ technology to provide a solution to these challenges. Dr. Zhang will highlight the benefits of Durafuse™ LT, a patented, innovative low-temperature mixed-alloy technology that offers enhanced reliability with drop shock performance two orders of magnitude better than Bi-containing solders. He will also discuss Durafuse™ HT, a new patent-pending product designed as a drop-in solution to replace and outperform the traditional high-lead solders in die-attach and clip-bond applications. Less
Relion Logo Header
Increasing Requirements for Electrical Reliability in Automotive Applications web logo
Increasing Requirements for Electrical Reliability in Automotive Applications
Current material test conditions for no-clean solder pastes are no longer sufficient. In particular, the test parameters according to J-STD 004B do not reflect the new, longer mission profile of automotive electrification applications. The parameters for test voltage, test time, and test structure do not fit hybrid or full EV applications. In order to prevent vehicle breakdowns caused by EMC effects such as dendrite growth, new test conditions are already being introduced. These are primarily driven by OEM and standards consortia such as DKE (German) and IEC (international). More
Due to changes in the operating conditions of electronic assemblies, new mission profiles are constantly needed for lifetime reliability. These also increase the demands on the materials used in assemblies. In the area of “no-clean” solder pastes, the focus is on the Surface Insulation Resistance (SIR) test as proof of the electrochemical duration reliability of these flux residues. For example, today’s existing test duration has increased from 168 hours to 1,000 hours (+600%). Some flux systems in solder pastes already have solutions to these new challenges. Less
Defining ‘High-Reliability’ web logo
Defining ‘High-Reliability’
How do we provide “high-reliability”? Just like a diamond scratches steel, but shatters when hit by a steel hammer – we choose the correct solder material for the application.  More
How do we provide “high-reliability”? Just like a diamond scratches steel, but shatters when hit by a steel hammer – we choose the correct solder material for the application. The industry is used to choosing between fluxes to improve process reliability and prevent defects – now that same challenge has to be addressed with solder alloys. To do that we work with customers and manufacturers to understand the temperature, mechanical, and process requirements to increase lifetime for the next generation of electronics. Less
The Challenges of High-Reliability Power Electronics Assembly and the Emerging Materials Solutions web logo
The Challenges of High-Reliability Power Electronics Assembly and the Emerging Materials Solutions
As power devices evolve to handle increased power density, higher junction temperatures, and smaller packaging, the enhanced requirements for high-reliability power electronics have posed many challenges to the packaging and assembly processes. More
As power devices evolve to handle increased power density, higher junction temperatures, and smaller packaging, the enhanced requirements for high-reliability power electronics have posed many challenges to the packaging and assembly processes. In The Challenges of High-Reliability Power Electronics Assembly and the Emerging Materials Solutions, ESM/Power Electronics Product Manager Joseph Hertline will analyze the major challenges within substrate- and die-attach applications, as well as provide an overview of the innovative materials solutions that can help achieve high power density and promote better heat dissipation, resulting in highly-reliable power devices. Less
Is modern no-clean solder paste truly no-clean, and does it provide comparable electrical reliability? web logo
Is modern no-clean solder paste truly no-clean, and does it provide comparable electrical reliability?
November 17, 2021 Presenter: Thuy Nguyen, Technical Support Engineer
Certain high-reliability pockets of the electronics industry – including telecommunications, defense, aerospace, and medical – place high value on the cleanliness of the finished PCBA. More
Certain high-reliability pockets of the electronics industry – including telecommunications, defense, aerospace, and medical – place high value on the cleanliness of the finished PCBA. For many modern applications that adapted to rosin-based, no-cleaned solder pastes and fluxes, the in-grained practice of cleaning for the sake of flux residue removal has lived on for a myriad of reasons. Due to miniaturization and other trends (such as lower standoffs), new no-clean solder pastes and fluxes are being developed with a higher requirement on Surface Insulation Resistance (SIR) to ensure electrical reliability without cleaning off the residue. However, have the enhanced properties of modern formulations mitigated the need to clean? Join Presenter Thuy Nguyen where she will go through the analysis of tests (J-STD-004B SIR test method) we performed with some new no-clean solder paste to get the answer. Less
Tin Whiskers web logo
Tin Whiskers
October 19, 2021 Presenter: Ron Lasky, Ph.D., PE, Senior Technologist
Tin whiskers continue to be a major concern in electronics assembly. This workshop will start with an explanation of tin whiskers and their formation. Then, it will summarize their potential risks and mitigation techniques. A description of Failure Modes and Effects Analysis (FMEA) as a technique to assess tin whisker risk, for a given technology, will then be discussed. More

Tin whiskers continue to be a major concern in electronics assembly. This workshop will start with an explanation of tin whiskers and their formation. Then, it will summarize their potential risks and mitigation techniques. A description of Failure Modes and Effects Analysis (FMEA) as a technique to assess tin whisker risk, for a given technology, will then be discussed.

Presenter Dr. Ron Lasky will conclude this workshop with a discussion of tin whisker reliability strategies for consumer and mission critical products. At the end of the presentation, attendees will have all of the basic relevant information to develop an effective tin whisker strategy.

Less
Intermetallics web logo
Intermetallics
October 5, 2021 Presenter: Ron Lasky, Ph.D., PE, Senior Technologist
In this webinar, Dr. Ron Lasky will review the formation of copper-tin intermetallics, their growth rate, their effect on thermal cycle life, and drop shock performance. The brittle nature of copper-tin intermetallics will also be discussed. In addition, several graphs of intermetallic growth rate will be presented. Some of the additional ancillary effects of copper-tin intermetallic growth – such as tin whiskers and their mitigation – will also be discussed. More

The formation of copper-tin intermetallics is fundamental to a functional solder joint. In creating most solder joints, two pieces of copper – which melt at 1085°C – are bonded together with solder, at less than 230°C. Most of us, with years of experience in electronic assembly, don’t usually think of this technological “miracle” of soldering. We are able to bond two pieces of copper together at a temperature low enough where the bonding can be performed in the presence of polymer material. Without this low-temperature formation of copper-tin intermetallics, the electronic industry might not exist. However, contemporary wisdom is that these intermetallics are brittle and can result in poor thermal cycle or drop shock performance.

In this webinar, Dr. Ron Lasky will review the formation of copper-tin intermetallics, their growth rate, their effect on thermal cycle life, and drop shock performance. The brittle nature of copper-tin intermetallics will also be discussed. In addition, several graphs of intermetallic growth rate will be presented. Some of the additional ancillary effects of copper-tin intermetallic growth – such as tin whiskers and their mitigation – will also be discussed.

Less
SiP Printing 101 web logo
SiP Printing 101
Solder paste printing is a complex process with many seemingly minute parameters which could cause defects in a soldered product and, if left untreated, yield losses and cost increases. More
Solder paste printing is a complex process with many seemingly minute parameters which could cause defects in a soldered product and, if left untreated, yield losses and cost increases. These defects are especially apparent and can happen quite often when printing for System-in-Package (SiP) components, which are smaller and have tighter component gaps than those of standard SMT. In SiP Printing 101, Evan Griffith, product specialist for Semiconductor and Advanced Assembly Materials, will outline the basics of fine-feature solder paste printing – as well as processes related to and affected by printing – and the advancements in printer technology which have simplified the SiP printing process. Griffith will also show data outlining the effects of changing important printing parameters and how Indium Corporation is innovating to meet the challenges of fine-feature printing. Less
Perfil de Reflujo 101 - Parte II web logo
Perfil de Reflujo 101 - Parte II
Los defectos de soldadura en SMT pueden surgir de tres áreas principales: diseño, materiales y proceso. Identificar la causa raíz y solucionar estos defectos puede resultar costoso More
Los defectos de soldadura en SMT pueden surgir de tres áreas principales: diseño, materiales y proceso. Identificar la causa raíz y solucionar estos defectos puede resultar costoso. Pueden existir muchas formas de resolver un defecto de proceso y, a menudo, la forma más fácil y menos costosa de resolver algunos de estos defectos de soldadura es optimizando el proceso de reflujo. Pero para comprender cómo optimizar mejor el perfil de reflujo, es crucial comprender los conceptos básicos detrás de los materiales/ingredientes de la soldadura. En las dos sesiones de “Perfil de Reflujo 101,” el presentador Iván Castellanos explicará algunos de los conceptos básicos de la ciencia de los materiales detrás de las pastas de soldadura y cómo este conocimiento se puede utilizar para optimizar el perfil de reflujo para resolver algunos defectos comunes de soldadura. Less
Perfil de Reflujo 101 - Parte I web logo
Perfil de Reflujo 101 - Parte I
Los defectos de soldadura en SMT pueden surgir de tres áreas principales: diseño, materiales y proceso. Identificar la causa raíz y solucionar estos defectos puede resultar costoso More

Los defectos de soldadura en SMT pueden surgir de tres áreas principales: diseño, materiales y proceso. Identificar la causa raíz y solucionar estos defectos puede resultar costoso. Pueden existir muchas formas de resolver un defecto de proceso y, a menudo, la forma más fácil y menos costosa de resolver algunos de estos defectos de soldadura es optimizando el proceso de reflujo. Pero para comprender cómo optimizar mejor el perfil de reflujo, es crucial comprender los conceptos básicos detrás de los materiales/ingredientes de la soldadura. En las dos sesiones de “Perfil de Reflujo 101,” el presentador Iván Castellanos explicará algunos de los conceptos básicos de la ciencia de los materiales detrás de las pastas de soldadura y cómo este conocimiento se puede utilizar para optimizar el perfil de reflujo para resolver algunos defectos comunes de soldadura.

 

Less
Comparing iNEMI Roadmap Predictions with Outcomes web logo
Comparing iNEMI Roadmap Predictions with Outcomes
August 10, 2021 Presenter: Ron Lasky, Ph.D., PE, Senior Technologist
In this webinar, Dr. Ron Lasky will compare past board assembly roadmaps with actual technological outcomes.  More
In this webinar, Dr. Ron Lasky will compare past board assembly roadmaps with actual technological outcomes. He will examine the progression of predictions across seven significant aspects of board assembly covered in the 1994, 2002, 2007, 2013 and 2017 roadmaps: 1) Conversion Costs, 2) NPI Cycle Time, 3) Component Trends, 4) Solder Paste, 5) Bar Solder, 6) Wave Solder Flux and 7) Die Attach Adhesives. As you will see, the conclusions are mixed: some aspects that the roadmaps covered were very accurate, while others could use improvement. NPI predictions were found to be extremely accurate quantitatively as well as qualitatively. On the opposite end, component trends saw the most discrepancy between the roadmaps’ predictions and actual technological outcomes. Also, maximum I/O density, minimum pitch for area array packages, and chip speed placement were all overestimated markedly, especially in the earlier roadmaps. He will discuss general conclusions on the outline and readability of the board assembly roadmaps. Less
Weibull Distribution and Analysis web logo
Weibull Distribution and Analysis
In this webinar, Dr. Ron Lasky will provide an overview of the Weibull distribution, its variables, the types of data required, and the interpretations that can be drawn from a Weibull distribution. More
The Weibull distribution was invented by Swedish engineer Waloddi Weibull in 1937. He published his paper on the subject in 1951. Although Weibull Analysis was initially met with skepticism, it is now used across many disciplines. The distribution describes cumulative failure rates and is often used in survival or reliability analysis of products. In contrast with binomial or Poisson distributions, the Weibull distribution can be reliable even with a very small sample size. This is very useful, as failures can be costly and dangerous, so large failure samples cannot be obtained. In this webinar, Dr. Ron Lasky will provide an overview of the Weibull distribution, its variables, the types of data required, and the interpretations that can be drawn from a Weibull distribution. Less
 Impresión de Soldadura en Pasta 101 - Sesión II web logo
Impresión de Soldadura en Pasta 101 - Sesión II
June 23, 2021 Presenter: Iván Castellanos

Impresión 101 … así cómo la industria de SMT ha evolucionado y se ha hecho cada vez más demandante y exigente, por lo tanto, es sumamente importante entender los principios básicos de los procesos.

More

Impresión 101 … así cómo la industria de SMT ha evolucionado y se ha hecho cada vez más demandante y exigente, por lo tanto, es sumamente importante entender los principios básicos de los procesos.

Uno de los pasos iniciales más importantes en los procesos de SMT, es depositar soldadura en pasta de manera correcta sobre nuestro PCB y es comúnmente realizado utilizando impresión por estencil.

Sin embargo, la mayoría de los defectos en procesos de SMT pueden tener relación con un mala impresión de soldadura en pasta. Retomando las bases del proceso y asegurando un set up adecuado puede ayudar en la prevención de defectos en tus líneas de SMT.

En dos sesiones de Impresión de soldadura en pasta 101, Ivan Castellanos hablara acerca del proceso de impresión de soldadura en pasta y diseños de experimentos (DOE) típicos que pueden ser utilizados para generar información y datos sobre cómo se comporta el proceso.

Less
Solder Paste Printing – Fundamentals and Best Practices web logo
Solder Paste Printing – Fundamentals and Best Practices web logo
Solder Paste Printing – Fundamentals and Best Practices

As the industry has evolved and SMT has become more demanding, it is important to understand the basics of the process. The first and the most important step in the SMT process is successfully getting the adequate amount of paste on the board, which is commonly done by stencil printing. However, the same step is also responsible for a majority of defects in the SMT process. 

More

As the industry has evolved and SMT has become more demanding, it is important to understand the basics of the process. The first and the most important step in the SMT process is successfully getting the adequate amount of paste on the board, which is commonly done by stencil printing. However, the same step is also responsible for a majority of defects in the SMT process. Going back to the basics and ensuring you have the correct materials, design and setup can save you from expensive defects down the line. In Solder Paste Printing - Fundamentals and Best Practices, presenters Liyakathali Koorithodi and Tushar Tike will talk about the material, design and process aspects affecting solder paste printing and proven ways to overcome these challenges.

About our co-presenters:

Liyakathali Koorithodi Area Technical Manager

Liyakathali is the Area Technical Manager for India. He provides support for Indium Corporation’s full line of materials for electronics assembly, semiconductor and advanced assembly, and thermal management markets. He is based in Chennai, India.

Liyakathali has more than 20 years of experience in electronics assembly manufacturing. He has a diploma in mechanical engineering from the Department of Technical Education, Government of Kerala, and is an SMTA-certified SMT Process Engineer. He earned his six-sigma green belt from Motorola University.

Liyakathali previously worked for several major manufacturing companies, including two years with Nokia in Chennai. In addition, Liyakathali has written articles for several industry publications and has presented at numerous technical conferences and customer sites.

Tushar Tike Area Technical Manager

Tushar is the Area Technical Manager for North and West India. He provides technical support for Indium Corporation’s electronics assembly materials, semiconductor and advanced assembly materials, engineered solders and thermal management materials. He is currently based in Mumbai, India.

Tushar joined Indium Corporation in 2019. He has previously worked as a process engineer for a global EMS provider in San Jose, Calif., where he focused on process stability and improvements in SMT and post-SMT stages for various product types.

He earned his B.Tech. in mechanical engineering from Mumbai University and an M.S. in industrial and systems engineering from the State University of New York at Binghamton. He is a Certified SMT Process Engineer (CSMTPE) and earned his Lean Six Sigma Green Belt Certification from Dartmouth College’s Thayer School of Engineering, N.H., U.S..

Less
 Impresión de Soldadura en Pasta 101 - Sesión I web logo
Impresión de Soldadura en Pasta 101 - Sesión I
June 16, 2021 Presenter: Iván Castellanos

Impresión 101 … así cómo la industria de SMT ha evolucionado y se ha hecho cada vez más demandante y exigente, por lo tanto, es sumamente importante entender los principios básicos de los procesos.

More

Impresión 101 … así cómo la industria de SMT ha evolucionado y se ha hecho cada vez más demandante y exigente, por lo tanto, es sumamente importante entender los principios básicos de los procesos.

Uno de los pasos iniciales más importantes en los procesos de SMT, es depositar soldadura en pasta de manera correcta sobre nuestro PCB y es comúnmente realizado utilizando impresión por estencil.

Sin embargo, la mayoría de los defectos en procesos de SMT pueden tener relación con un mala impresión de soldadura en pasta. Retomando las bases del proceso y asegurando un set up adecuado puede ayudar en la prevención de defectos en tus líneas de SMT.

En dos sesiones de Impresión de soldadura en pasta 101, Ivan Castellanos hablara acerca del proceso de impresión de soldadura en pasta y diseños de experimentos (DOE) típicos que pueden ser utilizados para generar información y datos sobre cómo se comporta el proceso.

Less
White Heat – Red Hot: The Thermal Management Market in High-Performance Computing and Artificial Intelligence/Machine Learning web logo
White Heat – Red Hot: The Thermal Management Market in High-Performance Computing and Artificial Intelligence/Machine Learning
April 28, 2021 Presenter: Andy Mackie, PhD, MSc

Thermal interface materials (TIMs) are typically thin films of material that transfer heat from one surface to a cooler one. The thermal engineer or thermal architect is faced with many choices when assessing which TIM will best conduct heat away from sensitive devices. Pure metal or metal-based TIMs may be overlooked, even though their inherently high bulk thermal conductivities and higher performance make them worthy of consideration.

More

Thermal interface materials (TIMs) are typically thin films of material that transfer heat from one surface to a cooler one. The thermal engineer or thermal architect is faced with many choices when assessing which TIM will best conduct heat away from sensitive devices. Pure metal or metal-based TIMs may be overlooked, even though their inherently high bulk thermal conductivities and higher performance make them worthy of consideration.

Metal TIMs have been successfully used for decades in high-end applications such as power amplifiers for military and aerospace; in single-die lidded packages for high-end server CPUs; and in consumer PC applications where even liquid metals have been used. The enormous increases in demand for reliable high-performance computing (HPC) and artificial intelligence/machine learning (AI/ML) applications, combined with both increased heat flux (W/cm2) and increased device sensitivity to temperature have led to a major semiconductor packaging focus on low thermal resistance solutions. Metal TIMs are an increasingly prominent part of that mix.

This webinar will examine the specific ways that the HPC and AI/ML market segments are driving an enormous growth in demand for high performance, and, increasingly, for metal-based TIMs, and will also explore how continuous innovation at Indium Corporation is allowing us to meet that demand.

Less
Low-Temperature Solder Innovation — Durafuse™ LT and the Low- to Mid-Temperature Space (2021) web logo
Low-Temperature Solder Innovation — Durafuse™ LT and the Low- to Mid-Temperature Space (2021)
April 6, 2021 Presenter: Claire Hotvedt, CSMTPE
Low-temperature soldering is not a “one alloy fits all” solution. Depending on the application, the actual temperature required for low-temperature soldering can vary widely. More

Low-temperature soldering is not a “one alloy fits all” solution. Depending on the application, the actual temperature required for low-temperature soldering can vary widely. In Low-Temperature Solder Innovation — Durafuse™ LT and the Low- to Mid-Temperature Space, Claire Hotvedt will examine Durafuse’s ability to bring mid-temperature drop shock properties into the upper edge of the low-temperature space, as well as low-temperature solder’s specific process limitations and lifetime requirements.

Less
Stencil Printing 101 – Session II web logo
Stencil Printing 101 – Session II
March 4, 2021 Presenter: Indium Corporation

As the industry has evolved and SMT has become more demanding, it is important to understand the basics of the process. One of the most important first steps in the SMT process is successfully getting the paste on the board, which is commonly done by stencil printing.

More

As the industry has evolved and SMT has become more demanding, it is important to understand the basics of the process. One of the most important first steps in the SMT process is successfully getting the paste on the board, which is commonly done by stencil printing. However, a majority of defects in the SMT process can stem from incorrect stencil printing setup. Going back to the basics and ensuring you have the correct setup can save you from defects down the line. In two sessions of Stencil Printing 101, Presenter Meagan Sloan, CSMTPE, will talk about the solder paste printing process and typical design of experiments (DOE) that can be used to obtain data on how the solder paste will perform.

 

Less
Stencil Printing 101 – Session I web logo
Stencil Printing 101 – Session I
March 2, 2021 Presenter: Indium Corporation

As the industry has evolved and SMT has become more demanding, it is important to understand the basics of the process. One of the most important first steps in the SMT process is successfully getting the paste on the board, which is commonly done by stencil printing.

More

As the industry has evolved and SMT has become more demanding, it is important to understand the basics of the process. One of the most important first steps in the SMT process is successfully getting the paste on the board, which is commonly done by stencil printing. However, a majority of defects in the SMT process can stem from incorrect stencil printing setup. Going back to the basics and ensuring you have the correct setup can save you from defects down the line. In two sessions of Stencil Printing 101, Presenter Meagan Sloan, CSMTPE, will talk about the solder paste printing process and typical design of experiments (DOE) that can be used to obtain data on how the solder paste will perform.

 

Less
Reflow 101 from a Solder Manufacturer’s Perspective – Session II web logo
Reflow 101 from a Solder Manufacturer’s Perspective – Session II
February 16, 2021 Presenter: Indium Corporation

Soldering defects in SMT can arise from three main areas: the design, the materials, and the process. Identifying the root cause and troubleshooting these defects can be timely and expensive.

More

Soldering defects in SMT can arise from three main areas: the design, the materials, and the process. Identifying the root cause and troubleshooting these defects can be timely and expensive. There can be many ways to resolve one solder issue and oftentimes the easiest and least expensive way to resolve one of these soldering defects is by adjusting the reflow process. But in order to understand how to best optimize the reflow profile, it is crucial to understand the basics behind the solder materials. In the two sessions of Reflow 101 from a Solder Manufacturer’s Perspective, Indium Corporation, will explain some of the materials science basics behind solder pastes and how this knowledge can be used to optimize the reflow profile in order to resolve some common solder defects.

Less
Reflow 101 from a Solder Manufacturer’s Perspective – Session I web logo
Reflow 101 from a Solder Manufacturer’s Perspective – Session I
February 10, 2021 Presenter: Indium Corporation

Soldering defects in SMT can arise from three main areas: the design, the materials, and the process. Identifying the root cause and troubleshooting these defects can be timely and expensive.

More

Soldering defects in SMT can arise from three main areas: the design, the materials, and the process. Identifying the root cause and troubleshooting these defects can be timely and expensive. There can be many ways to resolve one solder issue and often times the easiest and least expensive way to resolve one of these soldering defects is by adjusting the reflow process. But in order to understand how to best optimize the reflow profile, it is crucial to understand the basics behind the solder materials. In the two sessions of Reflow 101 from a Solder Manufacturer’s Perspective, Indium Corporation, will explain some of the materials science basics behind solder pastes and how this knowledge can be used to optimize the reflow profile in order to resolve some common solder defects.


 

Less
Ultrafine Solder Paste Dispensing for Heterogeneous Integration web logo
Ultrafine Solder Paste Dispensing for Heterogeneous Integration
January 26, 2021 Presenter: Kenneth Thum

Miniaturization has been, and continues to be, a challenge for the electronics industry. Assemblies are getting more complex and component spacing is steadily decreasing. With more dies and components packed into smaller footprints, the need for heterogeneous integration for advanced packaging is getting greater.

More

Miniaturization has been, and continues to be, a challenge for the electronics industry. Assemblies are getting more complex and component spacing is steadily decreasing. With more dies and components packed into smaller footprints, the need for heterogeneous integration for advanced packaging is getting greater. However, solder paste printing is not always possible in some packaging designs and solder paste dispensing can be an alternative method for solder paste deposition. Ultrafine solder paste dispensing is only achievable with the correct combination of dispensing equipment and solder materials. In Ultrafine Solder Paste Dispensing for Heterogeneous Integration, presenter Kenneth Thum will discuss different dispensing equipment technologies and important solder paste characteristics, along with sharing a solution for and steps on how to achieve consistent fine-dot dispensing.

Less
The Evolution of Lead-Free Solder Alloys web logo
The Evolution of Lead-Free Solder Alloys
January 19, 2021 Presenter: Hongwen Zhang

When the world was moving toward green manufacturing, lead-free soldering – originally driven by RoHS (Restriction on the use of Hazardous Substances in electrical and electronic equipment) of Europe – was becoming the mainstream for the electronics industry, and Sn-rich alloys – including SnAgCu, SnAg, and SnCu – have been prevailing for more than a decade.

More

When the world was moving toward green manufacturing, lead-free soldering – originally driven by RoHS (Restriction on the use of Hazardous Substances in electrical and electronic equipment) of Europe – was becoming the mainstream for the electronics industry, and Sn-rich alloys – including SnAgCu, SnAg, and SnCu – have been prevailing for more than a decade. While the electronics industry keeps advancing rapidly toward miniaturization, two important drivers are dictating the evolution of lead-free solders: low cost and high reliability. In “The Evolution of Lead-Free Solder Alloys,” Presenter Hongwen Zhang will discuss the evolution of lead-free solders after the implementation of lead-free soldering in the industry from 2006, covering: (1) the first generation of high-Ag SAC solders; (2) low Ag/zero Ag Sn-rich solders; (3) high-reliability SAC solders; (4) low-temperature lead-free solders; and (5) high-temperature lead-free bonding materials. Zhang will also discuss the market need, and the pros and cons of the representative materials in each group.

Less
Soldering Material Evolution for Heterogeneous Integration Assembly web logo
Soldering Material Evolution for Heterogeneous Integration Assembly
November 11, 2020 Presenter: Sze Pei Lim

The development of heterogeneous integration, which packs more dies or components into a smaller footprint, requires multiple technological advancements in various aspects of advanced packaging, such as substrate design, interconnect methods, and materials.

More

The development of heterogeneous integration, which packs more dies or components into a smaller footprint, requires multiple technological advancements in various aspects of advanced packaging, such as substrate design, interconnect methods, and materials. In this Soldering Material Evolution for Heterogeneous Integration Assembly webinar, presenter Sze Pei Lim will outline trends in various soldering material technology for heterogeneous integration, including solder paste, flip-chip, and ball-attach fluxes.

Less
5G Base Station Introduction: Soldering Challenges and Solutions web logo
5G Base Station Introduction: Soldering Challenges and Solutions
November 10, 2020 Presenter: Foo Siang Hooi

5G networks began rolling out in 2018. Although the technology is still in its early stages, it is expected that the networks will become faster and connect even more devices than now. The networks are powered by 5G base stations which include active antenna units (AAU), antennas, remote radio units (RRU), and base band units (BBU).

More

5G networks began rolling out in 2018. Although the technology is still in its early stages, it is expected that the networks will become faster and connect even more devices than now. The networks are powered by 5G base stations which include active antenna units (AAU), antennas, remote radio units (RRU), and base band units (BBU). In 5G Base Station Introduction: Soldering Challenges and Solutions, Presenter Foo Siang Hooi will provide an introduction to the 5G equipment found in base stations and will incorporate perspectives from materials suppliers and innovators. He will discuss the applications and the associated challenges in base station manufacturing, while providing insights on how to solve these challenges with preforms and other solders.

 

Less
DFx on High Density Assemblies web logo
DFx on High Density Assemblies
October 13, 2020 Presenter: Jonas Sjoberg

Implementing high-density assembly in all electronic products requires a lot of considerations. Before starting any development work or implementing a new technology, it is critical to understand the product and industry requirements and capabilities; if this is not fully understood, failure is the most probable outcome.

More

Implementing high-density assembly in all electronic products requires a lot of considerations. Before starting any development work or implementing a new technology, it is critical to understand the product and industry requirements and capabilities; if this is not fully understood, failure is the most probable outcome.

There are many ways to increase the packaging density. However, the use of new technologies poses a number of challenges for solder paste selection, PCB design, assembly process and reliability, and the type end-product will have different challenges, concerns, and requirements in all aspects. The assembly line for many of these end-products will look very similar, but specification limits would be different. And when it comes to material section – and solder paste in particular – the type of end-product plays a big role.

Even with the right solder paste selection, a good assembly process and a quality PCB can still result in component failure, leading to yield losses and extra cost. In this webinar, we will discuss selection of the correct solder paste based on end-product and the need for doing proper root cause analysis before making any material or processes changes.

Less
Entendiendo y solucionando el defecto de voids en componentes BTCs (QFNs) web logo
Entendiendo y solucionando el defecto de voids en componentes BTCs (QFNs)
September 22, 2020 Presenter: Ivan Castellanos

Los BTCs (Bottom Terminated Components) son componentes cada vez más comunes en la industria electrónica actual y con tendencia a incrementarse debido a su tamaño pequeño, excelente desempeño eléctrico y su habilidad de transferir el calor fuera del circuito integrado (IC).

More

Los BTCs (Bottom Terminated Components) son componentes cada vez más comunes en la industria electrónica actual y con tendencia a incrementarse debido a su tamaño pequeño, excelente desempeño eléctrico y su habilidad de transferir el calor fuera del circuito integrado (IC).

En esta presentación, Entendiendo y solucionando el defecto de voids en componentes BTCs (QFNs), Ivan Castellanos discutirá, como se forman los voids en QFNs y como minimizarlos. También se revisaran otros factores que afectan a los voids, como el diseño del estencil, el grosor (thickness) del estencil, perfil de reflujo, mesh y tipo de polvo de la soldadura y desde luego el tipo de soldadura. Así mismo, se revisara la utilización de preformas de soldadura para minimizar los voids.

Less
PCB and Component Warpage Defects: HiP/HoP and Non-Wet Opens – Causes and Solutions web logo
PCB and Component Warpage Defects: HiP/HoP and Non-Wet Opens – Causes and Solutions
September 9, 2020 Presenter: Bob Willis

Heating PCBs for soldering can cause the substrate and components to potentially warp. This can cause parts to expand and contract, leading to common soldering defects such as HiP/HoP and non-wet opens.

More

Heating PCBs for soldering can cause the substrate and components to potentially warp. This can cause parts to expand and contract, leading to common soldering defects such as HiP/HoP and non-wet opens. High-temperature lead-free soldering made these problems worse. To help solve these issues, interest had grown for low-temperature solders for reflow and selective soldering. However, not all companies have the ability to change the alloys they use. Invited guest speaker, Bob Willis will provide practical insights for common and not so common soldering and assembly problems relating to warpage. Some of the solutions as well as “shop floor tricks” will also be illustrated.

Less
Solder Attributes & Impact on Increased Product Reliability Requirements of Electronic Assemblies web logo
Solder Attributes & Impact on Increased Product Reliability Requirements of Electronic Assemblies
September 2, 2020 Presenter: Andreas Karch

The reliability specifications for the product lifetime validation of electronic assemblies are increasing due to the changing requirements of duration of use (increased cycles) as well as increased service temperatures (125-200°C). 

More

The reliability specifications for the product lifetime validation of electronic assemblies are increasing due to the changing requirements of duration of use (increased cycles) as well as increased service temperatures (125-200°C). This is especially true in high-reliability verticals such as automotive, RF, and industrial applications. This makes the choice of solder materials more critical, as the solder paste attributes have a direct impact on increased product service life reliability requirements. in "Solder Attributes & Impact on Increased Product Reliability Requirements of Electronic Assemblies," Andreas Karch will discuss the parameters that should be taken into consideration to calculate the service life using the Coffin-Manson model. He will also discuss innovative solder solutions to address the higher thermo-mechanical loads on solder joints due to the increased mission profiles and product lifetime validation requirements.

Less
Innovations in Liquid Metal Thermal Interface Materials web logo
Innovations in Liquid Metal Thermal Interface Materials
August 27, 2020 Presenter: Miloš Lazić

Gallium-based liquid metal has been used as a thermal interface material (TIM) in niche applications for years. 

More

Gallium-based liquid metal has been used as a thermal interface material (TIM) in niche applications for years. In Innovations in Liquid Metal Thermal Interface Materials, Presenter Miloš Lazić will examine the key challenges and material characteristics that have limited their more widespread adoption despite their high conductivity. He will also identify several material innovations that overcome, or minimize, some of those challenges.

Less
Ask the Intern: A Q&A Session with Indium Corporation’s Summer Interns web logo
Ask the Intern: A Q&A Session with Indium Corporation’s Summer Interns
August 6, 2020 Presenter: Joy Valencia

Indium Corporation’s summer internship program is not your average internship. And, to truly understand the unique experience, who better to ask than the interns themselves?

 

 

More

Indium Corporation’s summer internship program is not your average internship. And, to truly understand the unique experience, who better to ask than the interns themselves?

During this Ask the Intern webinar – presented by Marketing Communications Intern Joy Valencia, Indium Corporation’s 2020 summer interns will share their experiences of the whole internship process, from onboarding to everyday work life, as well as their advice for future applicants. The interns come from a variety of disciplines – engineering, marketing communications, human resources, product management, etc. – providing plenty of different perspectives. There will also be a time where viewers can submit their questions to be answered in real-time by the panelists. It will be an opportunity for the surrounding communities and curious students to become more acquainted with Indium Corporation’s summer internship program.

 

Less
5G Connectivity: Challenges and Gold Solutions web logo
5G Connectivity: Challenges and Gold Solutions
August 5, 2020 Presenter: Jenny Gallery

As a successor to 4G, the 5G connectivity network is sure to not only transform technology as we know it, but also provide an entirely new mobile experience for every user. 

More

As a successor to 4G, the 5G connectivity network is sure to not only transform technology as we know it, but also provide an entirely new mobile experience for every user. With the development of new technologies, new challenges are sure to follow. The high-speed and bandwidth needed within the 5G connectivity network result in two common issues facing companies that are producing this mobile technology: controlling thermal management of and maintaining strong solder joints in the hardware. In this webinar, Jenny Gallery will discuss the challenges and present solutions that can improve the thermal transfer of high-output lasers, as well as solving the weak joint issue on the gold-rich substrate of gallium nitride (GaN) dies.

Less
Cleaning No Cleans Doesn't Have to be a Dirty Job web logo
Cleaning No Cleans Doesn't Have to be a Dirty Job

There are very good reasons why the industry continues to use no-clean solder paste. However, there are also equally good reasons why a no-clean solder paste may still need additional cleaning. 

More

There are very good reasons why the industry continues to use no-clean solder paste. However, there are also equally good reasons why a no-clean solder paste may still need additional cleaning. Learn easy-to-follow steps to determine when and how to clean without sacrificing product performance with the joint webinar hosted by Indium Corporation and Kyzen.

Less
What's Driving: Automotive Electronics Assembly and Packaging  web logo
What's Driving: Automotive Electronics Assembly and Packaging
July 28, 2020 Presenter: Andy Mackie, PhD, MSc

The evolution of the automobile over the past decade has been faster than ever before, and the 2020s promise even more rapid progress. The changes we will all experience include the nature of car ownership, how the car is powered, increased safety, and driver automation.

More

The evolution of the automobile over the past decade has been faster than ever before, and the 2020s promise even more rapid progress. The changes we will all experience include the nature of car ownership, how the car is powered, increased safety, and driver automation. Each of these changes is only possible with advances in electronics hardware and systems, electronics assembly, and semiconductor packaging. Indium Corporation’s Dr. Andy Mackie will discuss the impact of these changes on electronics assembly and packaging, and the impact of mission profiles on component and systems level reliability.

Less
Innovación en soldadura de baja temperatura – Durafuse™ LT y el rango de baja a media te web logo
Innovación en soldadura de baja temperatura – Durafuse™ LT y el rango de baja a media te
July 21, 2020 Presenter: Ivan Castellanos

En soldadura de baja temperatura, no existe una aleación que cumpla con todos los requerimientos. La temperatura real o actual para condiciones de “baja temperatura” puede tener un rango muy amplio. 

 

More

En soldadura de baja temperatura, no existe una aleación que cumpla con todos los requerimientos. La temperatura real o actual para condiciones de “baja temperatura” puede tener un rango muy amplio. Además cada producto manufacturado, puede tener diferentes prioridades en relación a las principales propiedades del material. Es importante conocer y entender las limitaciones especificas del proceso y los requerimientos de tiempo de vida de cada ensamble manufacturado. La innovación en soldaduras de baja temperatura ha sido posible gracias a este conocimiento. Durafuse™ LT en un buen ejemplo, que como las propiedades de drop-shock de aleaciones de temperatura medias pueden ser posibles en límite superior de aleaciones de baja temperatura. Acompáñame a considerar las oportunidades y restricciones de soldaduras de baja temperatura.

 

Less
Power Electronics: Improve Bondline Control & Reliability with Reinforced Matrix Preforms web logo
Power Electronics: Improve Bondline Control & Reliability with Reinforced Matrix Preforms
June 23, 2020 Presenter: Karthik Vijay

Due to increasing electrification, especially in automotive power modules and RF communication, it is clear that uniform bondline control between the substrate and baseplate has a direct link to mechanical reliability. 

More

Due to increasing electrification, especially in automotive power modules and RF communication, it is clear that uniform bondline control between the substrate and baseplate has a direct link to mechanical reliability. An uneven bondline can result in early cracking and solder layer delamination due to stress concentration at the thinner joint areas. In Power Electronics: Improve Bondline Control & Reliability with a Reinforced Matrix Solder Solution, Vijay will examine how InFORMS®, a reinforced matrix solder composite preform (patent-pending ribbon), deliver uniform bondline control and enhancing reliability by a factor of 2X, and achieving the lowest cost of ownership.

Less
Voiding Workshop: Understand and troubleshoot voiding in bottom terminated components (BTCs) web logo
Voiding Workshop: Understand and troubleshoot voiding in bottom terminated components (BTCs)
June 11, 2020 Presenter: Dr. Ron Lasky
Bottom terminated components (BTCs) are one of the most common packages in electronics today with the highest growth rate due to their small size, excellent electrical performance, and ability to transfer heat away from the integrated circuit (IC). More

Bottom terminated components (BTCs) are one of the most common packages in electronics today with the highest growth rate due to their small size, excellent electrical performance, and ability to transfer heat away from the integrated circuit (IC). In his workshop, Understand and troubleshoot voiding in bottom terminated components, Dr. Lasky will discuss how voids form in QFNs and how to minimize them. He’ll also cover factors that affect voiding, such as stencil design, stencil thickness, reflow profile, solder paste particle size, and solder pastes. The use of solder preforms to minimize voiding will also be presented.

Less
Optimization of the Robotic Soldering Process: A Focus on Solder Spread and Spattering web logo
Optimization of the Robotic Soldering Process: A Focus on Solder Spread and Spattering
May 21, 2020 Presenter: Robert McKerrow
Adoption of robotic soldering is growing within the PCB Assembly industry. This method is more efficient than hand soldering, so it aids in alleviating human mistakes.  More
Adoption of robotic soldering is growing within the PCB Assembly industry. This method is more efficient than hand soldering, so it aids in alleviating human mistakes. However, as the industry grows, we’ve found there is not enough published data regarding this soldering technique. In Optimization of the Robotic Soldering Process: A Focus on Solder Spread and Spattering, Indium Corporation Senior Product Specialist Robert McKerrow III will present how cored wires with different flux percentage will affect robotic soldering performance. Less
Low-Temperature Solder Innovation — Durafuse™ LT and the Low to Mid-Temperature Space  web logo
Low-Temperature Solder Innovation — Durafuse™ LT and the Low to Mid-Temperature Space
May 13, 2020 Presenter: Claire Hotvedt

Low temperature soldering is not a one alloy fits all situation. The actual temperature required for “low temperature” applications can vary widely.

More

Low temperature soldering is not a one alloy fits all situation. The actual temperature required for “low temperature” applications can vary widely. In addition different products may have very different priorities regarding key properties. Understanding the specific process limitations and lifetime requirements is important for any PCB assembly. But innovation in low temperature soldering has truly highlighted the benefit of such understanding. Durafuse™ LT is a great example of bringing mid-temperature drop-shock properties into the upper edge of the low temperature space. Join me in considering the changing opportunities and restrictions of low temperature solder.

Less
DPAK Voiding: A Study to Determine the Origins of DPAK Voiding web logo
DPAK Voiding: A Study to Determine the Origins of DPAK Voiding
April 28, 2020 Presenter: Indium Corporation

Indium Corporation will host a webinar on liquid metal thermal interface materials.

More

Indium Corporation will host a webinar on liquid metal thermal interface materials.

Why does a D-PAK exhibit more voiding than other types of bottom termination components (BTCs)? In D-PAK Voiding: A Study to Determine the Origins of D-PAK Voiding, Flanagan will review voiding results based on an analysis of several process variables, such as adding weights to the tops and cutting off the leads of DPAKs, giving insight into the physics behind DPAK voiding, and providing an answer to the root cause. Her goal is to reveal how to remedy the phenomenon.

Less

View our list of upcoming webinars