Press Releases

Indium Corporation Senior Area Technical Manager for East China Leo Hu is scheduled to deliver a presentation on Low-Temperature Solder Material in Semiconductor Packaging Applications at SiP China

Indium Corporation® will feature its high-reliability AuLTRA® MediPro gold solder solutions at MEDevice Silicon Valley, taking place on November 20-21 in Silicon Valley, California. AuLTRA®

Indium Corporation was honored with a Global Technology Award during an award ceremony on October 22, 2024, at SMTA International in Rosemont, Illinois. The company received the

Indium Corporation is honored to announce that it has been awarded the Edward J. Pawenski Business/Industry Partnership Award by the New York Community College Trustees (NYCCT). The award was

Indium Corporation today announced that InnoJoin GmbH will be the exclusive global sales partner for NanoFoil® in component mounting applications. NanoFoil® is a leading nanotechnology material

As one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight and knowledge on a variety of industry-related

As one of the leading materials providers in the electronics assembly industry, Indium Corporation is proud to feature its innovative products and technical presentations at SMTA International

Indium Corporation is proud to announce its participation in the upcoming International Electronics Manufacturing Technology Conference (IEMT), taking place October 16-18 in Penang, Malaysia. Five

As one of the leading materials providers to the electronics assembly industry, Indium Corporation is proud to feature its industry-leading Durafuse solder technology at the Battery Show North

As one of the leading materials providers to the electronics assembly industry, Indium Corporation is proud to feature its innovative products at the International Symposium on Microelectronics,

Indium Corporation experts will lead three presentations and a poster presentation at the 57th International Symposium on Microelectronics, organized by the International Microelectronics

Indium Corporation has earned a Mexico Technology Award for its high-reliability mixed-alloy for solder paste, Durafuse HR. The award was presented during an awards ceremony on September 11 at the

Indium Corporation Senior Sales and Business Development Manager, Chris Nash, will present at the e-Mobility Conference at Productronica India, on September 12 in Delhi,

Indium Corporation Junior Application Engineer Siegfried Lorenz will present as part of Delsys Tech Day on Wednesday, September 11, in Lucerne, Switzerland. Lorenz will join nine other industry

As one of the leading materials providers to the electronics assembly industry, Indium Corporation is proud to feature its innovative Durafuse solder technology at Productronica India, September

Indium Corporation will feature a range of industry-leading, high-reliability solder products at the Guadalajara Expo & Tech Forum in Guadalajara, Jalisco, Mexico, September

As a proven leader in innovative materials solutions for future-forward technologies, Indium Corporation will proudly showcase its heterogeneous integration and assembly (HIA) products and thermal

Indium Corporation Senior Area Technical Manager Jason Chou will present on the timely topics of AI and EV technology at SEMICON Taiwan on September 5 in Taipei,Taiwan. Chous presentation will

Indium Corporation has honored nine of its employees for their technical industry contributions with its annual Silver Quill Award. While the companys thought leaders present technical content at

Indium Corporation is proud to introduce new, high-reliability Au-based Precision Die-Attach (PDA) Preforms. Compared to standard preforms, these gold-based PDA preforms offer a higher level of

Indium Corporation is pleased to introduce a new jetting solder paste to join its PicoShot series of products. PicoShot NC-6M is a no-clean, halogen-free, Type 6 powder-size material specifically