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Ivy University Professor Patty Coleman was at Simon Pearce Restaurant, having a solo lunch and relaxing as she watched the beautiful waterfall at the restaurant. As she enjoyed their signature

When it comes to electronics reliability, surface insulation resistance (SIR) testing is one of the most important, yet often overlooked, safeguards. Failures in SIR can lead to mission losses,

Innovative Metal TIMs for AI/GPU Processors As artificial intelligence (AI) and high-performance computing (HPC) technologies evolve, their computational demands have skyrocketed, leading to a

When people think of advancements in medical technology, things like surgery-assisting robots, AI diagnostics, or neurostimulators – like Neuralink’s ‘Blindsight’ –

It’s no secret that indium and indium-silver solder thermal interface materials (TIMs) show great potential for maximizing thermal performance in high-performance computing (HPC) and AI

In our previous guide, we introduced the world of low-temperature soldering and its growing importance in modern electronics assembly. Now, we will take a deeper dive into one of the key enabling

In electronics assembly, the soldering process is fundamental to creating reliable connections. Traditionally, this involves high reflow temperatures, often exceeding 240°C. However, as components

Computing power is surging across high-performance markets like AI, data centers, HPC, and automotive power electronics. As devices push the boundaries of performance, managing heat becomes a

In my previous blog post on formic acid soldering, I explained the technology of formic acid reflow soldering, the applications in which it can be beneficial over traditional reflow soldering, the

Indium oxidation is not merely a surface phenomenon—it plays a critical role in the performance and reliability of high-precision applications, including semiconductors, AI, high-performance

At Indium Corporation, we understand the challenges related to power electronics assembly; devices are increasing in complexity, while demands on performance and reliability grow stronger. On top of

Folks, The creation of solder balls, when assembling passive discrete components, has been an issue for decades (see Figure 1). The discovery that the “home plate” stencil aperture design

In the world of medical device manufacturing, where reliability and precision are critical, materials used in the assembly must meet the highest

Achieving efficiency, reliability, and exceptional thermal performance is crucial in package-attach soldering applications for power modules. However, the high reflow temperatures required by

A little over a year ago, I posted about the increase in interest regarding Cu sintering. In the past 12 months, that interest has has surged, highlighting Cu sintering's suitability for various

With the 4 Nations Face-Off hockey tournament held just recently in Canada and Boston, Massachusetts gained a lot of publicityfor its intensity and high level of play, and arguably pushed the NHL to

In the ever-evolving world of medical technology, quality, precision, and reliability are paramount. When it comes to manufacturing medical devices that can save lives or enhance one’s quality

During my first few weeks as a Technical Support Engineer at Indium Corporation, Iresearched extensively and consulted with my team to find out when flux should be used and why it’s essential

Folks, Let's see how Monica and Guy are doing in solving the too-high temperature reflow concern….. Patty was sitting in her office, and, typical to her dynamic personality, was excited and

Folks, Professor Patty Coleman is at it again. Let's listen in….. Monica Reese was conflicted as she sat at her desk. She was excited that Professor Patty Coleman helped her get a job with

Folks, I am working on a book with my Indium Corporation colleagues on tackling soldering defects in electronics.It is a follow up to our The Printed Circuits Assembler's Guide to Solder Defects.