CLINTON, N.Y., October 27, 2026 — Indium Corporation® Assistant Product Manager Foo Siang Hooi will discuss the critical factors that influence the performance of compressible metal thermal interface materials (TIMs) and their role in addressing the demands of next-generation cooling applications at TestConX China, October 29, in Suzhou, China.
The presentation, titled Beyond Thermal Conductivity: What Really Matters for Compressible Metal TIMs, investigates factors beyond thermal conductivity that influence the performance of compressible indium-based metal TIMs. Installation time, applied pressure, material thickness, and pattern geometry are all examined to demonstrate how plastic deformation, interfacial resistance, and surface conformity affect thermal resistance. The session will provide practical guidance for optimizing TIM configurations and assembly conditions to improve thermal performance and long-term reliability in AI accelerators, data center hardware, and power electronics.
Foo Siang Hooi is an assistant product manager at Indium Corporation, where he plays a pivotal role in driving business development and expansion efforts for engineered solder products throughout Asia. His responsibilities include delivering technical and commercial training on application technologies and products and ensuring a comprehensive understanding for clients and stakeholders. Foo earned a bachelor’s degree in electronics engineering from Multimedia University in Malaysia. He holds a Six Sigma Green Belt certification and is ISO 9000-certified.
TestConX visitors can attend Foo’s presentation on October 29, 13:30 CST. To learn more about Indium Corporation’s TIMs and power electronics materials solutions, visit indium.com.
À propos d'Indium Corporation
IndiumCorporation® est l'un des principaux raffineurs, fondeurs, fabricants et fournisseurs de matériaux destinés aux marchés mondiaux de l'électronique, des semi-conducteurs, des couches minces et de la gestion thermique. Sa gamme de produits comprend des soudures et des flux ; des alliages de brasage ; des matériaux d'interface thermique ; des cibles de pulvérisation ; de l'indium, du gallium, du germanium et de l'étain sous forme de métaux et de composés inorganiques ; ainsi quele NanoFoil®. Fondée en 1934, la société dispose d'un service d'assistance technique mondial et d'usines situées en Chine, en Allemagne, en Inde, en Malaisie, au Mexique, à Singapour, en Corée du Sud, au Royaume-Uni et aux États-Unis.
Pour plus d'informations sur Indium Corporation, rendez-vous sur www.indium.com ou envoyez un e-mail à [email protected]. Vous pouvez également suivre nos experts, « From One Engineer ToAnother® » (#FOETA), sur www.linkedin.com/company/indium-corporation/.
