Indium Corporations Ron Lasky, Ph.D., PE, senior technologist, will host a new session of his webinar on intermetallics and their importance to solder joints on Tuesday, Oct. 5, 10 a.m. San Francisco / 1 p.m. New York / 6 p.m. London / 7 p.m. Germany as part of the companys free webinar program, the InSIDER Series.
La formation d'intermétalliques cuivre-étain est fondamentale pour un joint de soudure fonctionnel. Pour créer la plupart des joints de soudure, deux morceaux de cuivre - qui fondent à 1085C - sont reliés par de la soudure, à moins de 250C.
Most of us, with years of experience in electronics assembly, dont usually think of this technological miracle of soldering. We are able to bond two pieces of copper together at a temperature low enough where the bonding can be performed in the presence of polymer material. Without this low-temperature formation of copper-tin intermetallics, the electronics industry might not exist, said Dr. Lasky. However, contemporary wisdom is that these intermetallics are brittle and can result in poor thermal cycle or drop shock performance.
Au cours de ce webinaire, M. Lasky examinera la formation des intermétalliques cuivre-étain, leur taux de croissance, leur effet sur la durée de vie du cycle thermique et la performance en cas de choc de chute. La nature fragile des intermétalliques cuivre-étain sera également abordée. En outre, plusieurs graphiques du taux de croissance des intermétalliques seront présentés. Certains des effets auxiliaires de la croissance intermétallique cuivre-étain, tels que les moustaches d'étain et leur atténuation, seront également abordés.
Dr. Laskys webinar is offered as part of Indium Corporations free webinar program, the InSIDER Series. You can register for his webinar at https://indium.news/3kGbDwR.
Dr. Lasky is a senior technologist at Indium Corporation, as well as a professor of engineering and the director of the Lean Six Sigma program at Dartmouth College in Hanover, N.H., U.S. He has more than 30 years of experience in electronics and optoelectronics packaging at IBM, Universal Instruments, and Cookson Electronics. Dr. Lasky has authored six books, and contributed to nine more, on science, electronics, and optoelectronics, and has authored numerous technical papers. Additionally, he has served as an adjunct professor at several colleges, teaching more than 20 different courses on topics ranging from electronics packaging, materials science, physics, mechanical engineering, and science and religion. Dr. Lasky holds numerous patent disclosures and is the developer of several SMT processing software products relating to cost estimating, line balancing, and process optimization. He is the co-creator of Surface Mount Technology Associations (SMTA) SMT Process Engineering Certification program and exams that set standards in the electronics assembly industry worldwide. Dr. Lasky was awarded the Surface Mount Technology Associations (SMTA) Technical Distinction Award in 2021 for his significant and continuing technical contributions to the SMTA. He was also awarded SMTAs prestigious Founders Award in 2003.
À propos d'Indium Corporation
Indium Corporation est un raffineur, un fondeur, un fabricant et un fournisseur de matériaux de premier plan pour les marchés mondiaux de l'électronique, des semi-conducteurs, des couches minces et de la gestion thermique. Ses produits comprennent des soudures et des flux, des brasures, des matériaux d'interface thermique, des cibles de pulvérisation, des métaux et des composés inorganiques d'indium, de gallium, de germanium et d'étain, ainsi que des feuilles NanoFoil. Fondée en 1934, l'entreprise dispose d'une assistance technique mondiale et d'usines situées en Chine, en Allemagne, en Inde, en Malaisie, à Singapour, en Corée du Sud, au Royaume-Uni et aux États-Unis.
Pour plus d'informations sur Indium Corporation, visitez le site www.indium.com ou envoyez un courriel à Jingya Huang. Vous pouvez également suivre nos experts, From One Engineer To Another (#FOETA), sur www.linkedin.com/company/indium-corporation/ ou @IndiumCorp.
