Indium Corporation's Kenneth Thum, senior technical support engineer, and Nguyen Viet Truong, assistant technical manager for Asia Pacific operations, will present at the upcoming IPC Conferences on Assembly and Reliability in Vietnam and Thailand.
On Jan. 27, Truong will present Thermal Pad Design and Process for Voiding Control at QFN Assembly in Ho Chi Minh City, Vietnam. QFNs are receiving increasing attention in the electronics industry; however, controlling voids is a major challenge due to the large coverage area, large number of vias, and low standoff. This presentation discusses the effect that certain variables have on voiding performance.
Thum will present The Second Generation Shock Resistant and Thermally-Reliable Low Ag SAC Solder with Mn on Jan. 29 in Bangkok, Thailand. He will discuss SAC0510M, a solder alloy doped with Mn, and how it can greatly improve thermal fatigue performance and drop-shock resistance. The improvement eliminates the need for underfilling BGAs and CSPs in mobile device assembly.
Truong is responsible for providing technical support for Indium Corporation's electronics assembly materials, semiconductor and advanced assembly materials, engineered solders, and thermal management materials. He is an SMTA-certified process engineer and earned a degree from the Hanoi University of Science and Technology.
Thum provides technical support and process troubleshooting expertise to Indium Corporation's customers. His experience involves delivering yield improvements and enhanced supplier quality. Thum earned his bachelor's degree in computer-aided design and computer-aided manufacturing from the University of Malaya. Additionally, he is an SMTA-certified process engineer.
L'IPC est une association commerciale mondiale qui se consacre à la promotion de l'excellence concurrentielle et de la réussite financière de ses membres de l'industrie électronique.
Indium Corporation est un fabricant et fournisseur de matériaux de premier plan sur les marchés mondiaux de l'électronique, des semi-conducteurs, de l'énergie solaire, des couches minces et de la gestion thermique. Ses produits comprennent des soudures et des flux, des brasures, des matériaux d'interface thermique, des cibles de pulvérisation, des métaux et des composés inorganiques à base d'indium, de gallium, de germanium et d'étain, ainsi que des NanoFoil®. Fondée en 1934, Indium dispose d'une assistance technique mondiale et d'usines situées en Chine, en Malaisie, à Singapour, en Corée du Sud, au Royaume-Uni et aux États-Unis.
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