Indium Corporation experts Dr. HongWen Zhang, R&D manager alloy group, and Dr. Ronald Lasky, senior technologist, are set to deliver presentations at SMTAs International Conference for Electronics Hardware Enabling Technologies (ICEHET) in Toronto, Ontario, June 14-15.
As thermal demands continue to grow for high-performance computing chips, traditional polymer-based thermal interface materials (TIMs) such as greases and phase change materials are reaching their limits for use. Their relatively low thermal conductivity means they are not able to dissipate enough heat for these emerging applications. In Dr. Laskys presentation, Gallium Liquid Metal: Fundamentals to Enable Development of Ultra-High Performance Thermal Interface Materials, he will explore some of the critical properties of gallium alloys and how they affect the performance and usability as a TIM. Gallium alloys have some unique physical properties and attributes, and a better fundamental understanding of gallium alloys makes the creation of next-generation liquid metals possible to address the limitations of the first-generation alloys.
The harmful effects of lead on human health and the environment are driving the development of high-temperature lead-free (HTLF) solders to replace high-lead solders for die-attachment and clip-bond in power device applications. In his presentation, A Drop-In High-Temperature Pb-Free Solder Paste Outperforms High-Pb Pastes in Power Discrete Applications, Dr. Zhang examines a new formulation of Indium Corporations innovative material Durafusea novel design based on a mixed-alloy technologydesigned to deliver an Sn-rich HTLF paste, presenting the merits of both constituent alloys. This product, Durafuse HT, has shown the feasibility as a drop-in solution to replace high-Pb solders for die-attach in power discrete applications by delivering improved performance.
Dr. Lasky is a senior technologist at Indium Corporation, as well as a professor of engineering at Dartmouth College, Hanover, N.H., U.S. He has more than 30 years of experience in electronics and optoelectronics packaging at IBM, Universal Instruments, and Cookson Electronics. He has authored six books and contributed to nine others on science, electronics, and optoelectronics; he has authored numerous technical papers. Additionally, he has served as an adjunct professor at several colleges, teaching more than 20 different courses on topics such as electronics packaging, materials science, physics, mechanical engineering, and science and religion. He holds numerous patent disclosures and is the developer of several SMT processing software products relating to cost estimating, line balancing, and process optimization. He is the co-creator of engineering certification exams that set standards in the electronics assembly industry worldwide. Dr. Lasky was awarded the Surface Mount Technology Associations (SMTA) Technical Distinction Award in 2021 for his significant and continuing technical contributions to the SMTA. He was also awarded SMTAs prestigious Founders Award in 2003.
Dr. Zhang is manager of the alloy group in Indium Corporations R&D department. His focus is on the development of Pb-free solder materials and the associated technologies for high-temperature and high-reliability applications. He was instrumental in inventing the mixed-alloy solder technique to combine the merits of constituents to improve wetting, reduce processing temperatures, modify the bonding surface, and control the joints morphology, thus improving reliability. He has a bachelors degree in metallurgical physical chemistry from Central South University of China, a masters degree in materials and engineering from the Institute of Metal Research, Chinese Academy of Science, and a masters degree in mechanical engineering and a Ph.D. in materials science and engineering from the Michigan Technological University, Houghton, Mich., U.S. He has a Six Sigma Green Belt from the Thayer School of Engineering at Dartmouth College, and is a certified IPC Specialist for IPC-A-600 and IPC-A-610 as well as a certified SMT Process Engineer. He has extensive experience in various aluminum (Al) alloys and fiber/particle reinforced Al-based composite materials, and Al-rich and ZrHf-based amorphous alloys. He has co-authored two book chapters on high-temperature lead-free bonding materials, has had a number of patents filed, and has been published in approximately 20 journals in the fields of metallurgy, materials science and engineering, physics, electronics materials, and mechanics.
À propos d'Indium Corporation
Indium Corporation est un raffineur, un fondeur, un fabricant et un fournisseur de matériaux de premier plan pour les marchés mondiaux de l'électronique, des semi-conducteurs, des couches minces et de la gestion thermique. Ses produits comprennent des soudures et des flux, des brasures, des matériaux d'interface thermique, des cibles de pulvérisation, des métaux et des composés inorganiques d'indium, de gallium, de germanium et d'étain, ainsi que des feuilles NanoFoil. Fondée en 1934, l'entreprise dispose d'une assistance technique mondiale et d'usines situées en Chine, en Allemagne, en Inde, en Malaisie, à Singapour, en Corée du Sud, au Royaume-Uni et aux États-Unis.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email Jingya Huang. You can also follow our experts, From One Engineer To Another (#FOETA), at www.linkedin.com/company/indium-corporation/ or @IndiumCorp.
À propos de l'ICEHET
ICEHET is a renaming of the International Conference on Soldering and Reliability (ICSR), which has been held every year since about 2003. This event features presentations on current topics and challenges involving electronics materials, components, assembly, and reliability of the products that have become essential in many aspects of modern life. Learn more at www.smta.org/icehet.
