Indium Corporation Senior Technologist Dr. Ronald Lasky and Senior Product Development Specialist Kevin Brennan will deliver a series of presentations at the Pan Pacific Strategic Electronics Symposium (Pan Pac 2025), taking place January 27-30 in Maui, Hawaii.
Dr. Lasky’s first presentation, Electronics: Down Memory Lane and a Vision for the Future, will explore the evolution of electronics, from early vacuum tube technology to modern innovations such as artificial intelligence and robotics. Dr. Lasky will highlight key milestones of technology’s rapid advancements throughout history and discuss how the optimization of resources and advanced AI integration are streamlining and shaping the future of electronics.
The second presentation, titled Low-Temperature Attach: Today and Tomorrow, will focus on advancements in low-temperature soldering technologies, including bismuth-tin alloys and metastable solder pastes. These innovations enable secure interconnections at significantly lower temperatures – crucial for next-generation electronics requiring delicate material handling and enhanced performance.
“For over a century, electronics innovation has been the cornerstone of our ever-evolving tech industry,” said Dr. Lasky. “At Pan Pac, I look forward to discussing the advancements that have brought us to this point, and the promising future ahead.”
Brennan’s presentation, Mastering Complexity: A Solder Material Solution to Manage Component Warpage and Uneven Thermal Gradients in Modern Electronics Manufacturing, addresses the challenges posed by larger, more complex integrated circuit chips and high-density circuit boards, including component warpage and uneven heating during reflow processes. Brennan will highlight the use of a novel, low-temperature alloy that reduces peak reflow temperatures by 20-40°C compared to SAC305. This solution effectively mitigates warpage and enhances manufacturing reliability for modern electronics.
About Indium Corporation
IndiumCorporation® est l'un des principaux raffineurs, fondeurs, fabricants et fournisseurs de matériaux destinés aux marchés mondiaux de l'électronique, des semi-conducteurs, des couches minces et de la gestion thermique. Sa gamme de produits comprend des soudures et des flux ; des alliages de brasage ; des matériaux d'interface thermique ; des cibles de pulvérisation ; de l'indium, du gallium, du germanium et de l'étain sous forme de métaux et de composés inorganiques ; ainsi quele NanoFoil®. Fondée en 1934, la société dispose d'un service d'assistance technique mondial et d'usines situées en Chine, en Allemagne, en Inde, en Malaisie, à Singapour, en Corée du Sud, au Royaume-Uni et aux États-Unis.
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