Indium Corporation‘s Technical Manager for Europe, Karthik Vijay, will present his technical findings at IMAPS-UK RaMP RF and Microwave Packaging workshop on March 21 in Edinburgh, Scotland.
Karthik will present Engineered Solders in RF & Microwave Packages. This paper discusses how engineering unique attributes into solder preforms exponentially increases the reliability and manufacturing windows of RF and microwave packages. Examples include: Au/Sn solder frames with no trapped oxide or contaminants to achieve a reliable hermetic seal; flux-coated InAg preforms (which melt at 143°C) to achieve very low-voiding; and solder-based thermal interface materials that do not require reflow, for superior thermal management.
Karthik joined Indium Corporation in 2003. He earned his master’s degree in Industrial Engineering with a specialization in Electronics Packaging & Manufacturing from the State University of New York at Binghamton. He is an SMTA-certified engineer and earned his Six Sigma Green Belt certification from Dartmouth College’s Thayer School of Engineering.
For more information about IMAPS-UK RaMP RF and Microwave Packaging workshop, visit uk.imapseurope.org.
Indium Corporation est un fournisseur de matériaux de premier plan pour les marchés mondiaux de l'électronique, des semi-conducteurs, de l'énergie solaire, des couches minces et de la gestion thermique. Ses produits comprennent des soudures, des préformes et des flux, des brasures, des cibles de pulvérisation, des produits chimiques et des sources d'approvisionnement en indium, gallium et germanium, ainsi que Reactive NanoFoil®. Fondée en 1934, Indium Corporation dispose d'une assistance technique mondiale et d'usines situées en Chine, à Singapour, en Corée du Sud, au Royaume-Uni et aux États-Unis.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].
