Communiqués de presse

Indium Corporation‘s Claire Hotvedt, CSMTPE, product development specialist, will present on low-temperature solders for printed circuit board (PCB) assembly at the SMTA Boise Expo

Indium Corporations Adam Murling, assistant technical manager, will participate in a Global SMT & Packaging panel discussion on head-in-pillow (HIP) on Tuesday, April 19, at

Indium Corporation will feature products from its line of proven gallium-based liquid metal thermal solutions at SEMI-THERM, March 21-25, San Jose, Calif., U.S.  Indium Corporation is

Indium Corporations Milo Lazi, product development specialist, will share his industry knowledge on metal thermal interface materials (TIMs) in high-performance applications

Indium Corporation will feature selections from its portfolio of high-reliability solutions for power electronics at the International Conference on Integrated Power

The InSIDER SeriesIndium Corporations free webinar program designed for professional developmenthas included more than 30 topics presented to thousands of industry professionals via its live

Indium Corporation has expanded its flux portfolio with a new liquid flux designed to meet process needs for low-temperature flip-chip applications. WS-3910 is a water-soluble, halogen-free

Indium Corporation is pleased to announce that Dr. Yan Liu has assumed additional responsibilities within the company. In addition to serving as manager of the R&D Flux Group, she

Indium Corporation will feature its portfolio of high-reliability solutions for power electronics at APEC 2022, March 20-24, Houston, Texas, U.S. Indium Corporation offers a robust

Indium Corporations Tim Jensen, global account manager and senior thermal technologist, will participate in the International Electronics Manufacturing Initiatives virtual Packaging Tech Topic

Indium Corporations Brian OLeary, global accounts manager and global head of e-Mobility and infrastructure, will be presenting on market trends in the thriving electric vehicle (EV) landscape at

Indium Corporation‘s Evan Griffith, product specialist, will share his technical knowledge and insight on the evolution of solder paste for semiconductor applications at

The development of a novel high-temperature lead-free solder for die-attach in power discrete applications will be the focus of a presentation by Indium Corporations Dr. HongWen

Indium Corporations Brian OLeary, global accounts manager and global head of e-Mobility and infrastructure, will be presenting on market trends in the thriving electric vehicle (EV) landscape at

Indium Corporation has immediate openings for Production Operators and other positions at its Rome and Clinton facilities and is offering prospective employees the opportunity for immediate

Indium Corporation has earned a Visionary Partnership Award from NSW Automation for the development of its innovative Indium12.8HF Solder Paste following an appreciation

Indium Corporations innovative materials for advanced semiconductor packaging will be the focus of a presentation by Dr. Dongkai Shangguan, strategic advisor, at the Surface Mount

Indium Corporation is pleased to announce several personnel updates at the companys facility located on Robinson Road in Clinton, New York.  Kay Parker has accepted a new role as a

Indium Corporation has expanded its manufacturing capabilities to include a fine diameter 0.004 (0.10mm) flux-cored wire made with select Pb-free alloys to help customers meet the