Communiqués de presse

Indium Corporation Principal Engineer and Manager for Thermal Interface Materials Applications Andy Mackie, Ph.D., M.Sc., has taken on a new role on the iNEMI Board of Directors.

Indium Corporation is announcing the release of InTACK, a drop-in, robust tacking agent for power module assembly at PCIM Europe, May 10-12, Nuremberg, Germany.   InTACK is a no-clean,

Indium Corporations Dr. Ron Lasky will share his technical insight on the importance of Design of Experiments to optimize the electronics assembly process as part of the companys

Indium Corporation‘s Ross Berntson, President and COO, will deliver the keynote presentation at TestConX, to be held May 1-4, in Mesa, Ariz., US.  Berntson will be presenting on

Indium Corporations Alloy Group R&D Manager Dr. HongWen Zhang will deliver a presentation on the companys award-winning Durafuse mixed-alloy technology as part of its

Indium Corporation is pleased to announce that 16 employees have earned SMTA certification as part of its ongoing mission to invest in its technical talent to ensure customer success through

Indium Corporations Alloy Group R&D Manager Dr. HongWen Zhang will present on a high-temperature lead-free solder paste at the International Conference on Electronics

Indium Corporation has immediate openings for Production Operators and other positions at its Rome and Clinton facilities and is offering prospective employees the opportunity for immediate

Indium Corporation is proud to announce that Amy Schultz has been promoted to the position of senior specialist I, based at the company headquarters in Clinton, New

Indium Corporations Brian OLeary, global accounts manager and global head of e-Mobility and infrastructure, will be presenting on market trends in the thriving electric vehicle (EV) landscape at

As part of its popular InSIDER Series of webinars, Indium Corporation is excited to launch a new series focusing on the opportunities and challenges present in the rapidly

Indium Corporation‘s Claire Hotvedt, CSMTPE, product development specialist, will present on low-temperature solders for printed circuit board (PCB) assembly at the SMTA Boise Expo

Indium Corporations Adam Murling, assistant technical manager, will participate in a Global SMT & Packaging panel discussion on head-in-pillow (HIP) on Tuesday, April 19, at

Indium Corporation will feature products from its line of proven gallium-based liquid metal thermal solutions at SEMI-THERM, March 21-25, San Jose, Calif., U.S.  Indium Corporation is

Indium Corporations Milo Lazi, product development specialist, will share his industry knowledge on metal thermal interface materials (TIMs) in high-performance applications

Indium Corporation will feature selections from its portfolio of high-reliability solutions for power electronics at the International Conference on Integrated Power

The InSIDER SeriesIndium Corporations free webinar program designed for professional developmenthas included more than 30 topics presented to thousands of industry professionals via its live

Indium Corporation has expanded its flux portfolio with a new liquid flux designed to meet process needs for low-temperature flip-chip applications. WS-3910 is a water-soluble, halogen-free

Indium Corporation is pleased to announce that Dr. Yan Liu has assumed additional responsibilities within the company. In addition to serving as manager of the R&D Flux Group, she