Communiqués de presse

Indium Corporation‘s Product Development Specialist Milo Lazi will share his industry knowledge on thermal interface materials (TIMs) at PCB Carolina on Nov. 10 in Raleigh,

Indium Corporation will feature its proven solder solutions live on the show floor throughout SMTA International from Nov. 1-4 in Minneapolis, Minn., USA.  Live@SMTAI is a

Indium Corporations Brian OLeary, global accounts manager and global head of e-Mobility and infrastructure, will be participating in an electric vehicles (EV) roundtable discussion at SMTA

Three of Indium Corporations esteemed colleagues will share their industry knowledge and expertise during four presentations at SMTA International from Nov. 1-4 in Minneapolis, Minn.

Indium Corporations Andreas Karch, regional technical manager and technologist advanced applications, will present on thermal management at EPPs specialist forum: LED Meets

Indium Corporation has a number of immediate openings in its Utica, Rome, and Clinton facilities and is offering prospective employees the opportunity for on-the-spot interviews as part of its

Class is in session once again as Indium Corporation offers a new round of its successful test for industry professionals to measure their surface mount technology (SMT) knowledge.

Indium Corporations Ron Lasky, Ph.D., PE, senior technologist, will host a new session of his webinar on intermetallics and their importance to solder joints on Tuesday, Oct. 5,

It is with great sadness that Indium Corporation announces the passing of Chairman William (Bill) N. Macartney III on September 14, 2021.  Macartney leaves behind a company he served

Indium Corporations Chris Nash, senior product manager, PCB assembly solder paste, will participate in a Global SMT & Packaging debate on solder paste technology on Oct. 26 at 7:30

Indium Corporation will feature its high-reliability, precision gold solder solutions for critical applications during Space Tech Expo from Oct. 6-8 at Long Beach, Calif. Aerospace and

Tin whiskers are thinner than a human hair, but these electrically-conductive structures have been known to cause sudden failures and intermittent problems due to their ability to short closely

Indium Corporations Ron Lasky, Ph.D., PE, senior technologist, will host a webinar on intermetallics and their importance to solder joints on Tuesday, Sept. 21, 10 a.m. San Francisco/1

Shrinking stencil apertures and gaps between pads have necessitated more critical solder paste printing requirements. Indium Corporation expert Leo Hu, senior area technical manager, will

Indium Corporations Leo Hu, senior area technical manager East China, and Nordsons Jonas Chen, China Applications Manager of AXI Products, will co-present a joint paper on using

An Indium Corporation expert will share her expertise on the global indium market at the 2021 Minor Metals Industry Summit, September 13-14, Changsha, Hunan Province, China.

Indium Corporations Leo Hu, senior area technical manager East China, will share insights on tool-free solder preform technology for power module assembly during a poster session at PCIM

Indium Corporation introduces Indium12.8HF as it continues to develop innovative solder paste solutions to meet customers’ current and emerging needs. Indium12.8HF is a versatile paste

Five Indium Corporation experts will participate in the SMTA South China Conference, Aug. 25-27, Shenzhen, China. This event is held in conjunction with NEPCON Asia 2021 at the

Indium Corporations Evan Griffith, product specialist for Semiconductor and Advanced Assembly Materials, will host two webinar sessions about the fundamentals of System-in-Package (SiP) printing