Communiqués de presse

In January, Indium Corporation partnered with Finetech for MIT’s Integrated Photonics Bootcamp, a week-long, hands-on learning experience held at

Indium Corporation’s Miloš Lazi, Technical Support Engineer, was honored with a special recognition award at IPC APEX Expo 2020 on February 5 in San Diego, Calif., USA. Lazi

Indium Corporation has earned the CIRCUITS ASSEMBLY New Product Introduction (NPI) Award for its low-temperature alloy technology, Durafuse™ LT at the IPC APEX

Indium Corporation will feature more than a dozen of its high-reliability products live on the IPC APEX Expo show floor, giving conference attendees opportunities to witness them in

Indium Corporation’s Tim Jensen, Senior Product Manager, Solder Preform and Thermal Technology, will present on metal thermal interface materials during the IMAPS European

Indium Corporation, Utica’s Technology Company®, is proud to announce the promotion of Jonathan Minter to the position of Research Chemist. Jonathan is based at the company’s Clinton

Indium Corporation continues to develop innovative solder paste solutions to fit customers' needs. PicoShot™ NC-5M is designed for customers needing a no-clean halogen-free

Indium Corporation will feature its precision AuSn preforms for die-attach applications at SPIE Photonics West, Feb. 1-6, in San Francisco, Calif., USA. Indium Corporation’s AuLTRA™

Several Indium Corporation technical experts will share their knowledge at the IPC APEX Expo, Feb. 1-6, in San Diego, Calif., USA. The following technical papers from Indium Corporation experts

Indium Corporation will feature its metal thermal interface materials (TIMs) for burn-in and test at TestConX, May 10-13 in Mesa, Arizona, USA. Indium Corporation’s wide portfolio of

 Indium Corporation’s Ross Berntson, President and COO, will deliver the keynote presentation at TestConX, to be held May 10-13, 2020 in Mesa, Arizona, USA. Berntson will be presenting on

Indium Corporation’s Donna Vareha-Walsh, Director of Sales and Global Supply Chain and Trade Compliance, will share her industry expertise at the 6th Annual World Congress

Indium Corporation has formed a new sales partnership with InnoJoin GmbH to better serve its NanoFoil® customers in Europe. Indium Corporation will continue to produce large un-plated sheets

Indium Corporation’s Dr. Ronald C. Lasky, Senior Technologist, will present at Pan Pacific Microelectronics Symposium 2020 (PanPac) in Big Island, Hawaii, USA, February, 10-13, 2020. Tuesday,

Indium Corporation, Utica’s Technology Company®, is proud to announce the promotion of Claire Hotvedt to the position of Product Development Specialist. She is based at the company’s

Two of Indium Corporation’s experts will present on high-reliability materials and process optimization at the Eletrain Advanced Packaging and High-Reliability Seminar on December 12 in

Indium Corporation will feature an innovative alloy and solder flux pairing that provides high-reliability and enhanced-performance capabilities at IPC APEX Expo February 4-6, in San Diego,

Indium Corporation will feature its new high-performance, high-reliability alloy technology at IPC APEX Expo, February 4-6, in San Diego, Calif., USA.Durafuse™ LT is a novel,

Indium Corporation, Utica’s Technology Company®, is proud to announce the promotion of three

Indium Corporation continues to innovate alloy technologies with a new high-performance, high-reliability low-temperature alloy.  Durafuse™ LT is a novel, low-temperature alloy

Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS®, for IGBT assembly at NEPCON Japan, January 15-17, Tokyo, Japan. Uneven solder bondline thickness