Communiqués de presse

Indium Corporation’s Donna Vareha-Walsh, Director of Sales and Global Supply Chain and Trade Compliance, will share her industry expertise at the 6th Annual World Congress

Indium Corporation has formed a new sales partnership with InnoJoin GmbH to better serve its NanoFoil® customers in Europe. Indium Corporation will continue to produce large un-plated sheets

Indium Corporation’s Dr. Ronald C. Lasky, Senior Technologist, will present at Pan Pacific Microelectronics Symposium 2020 (PanPac) in Big Island, Hawaii, USA, February, 10-13, 2020. Tuesday,

Indium Corporation, Utica’s Technology Company®, is proud to announce the promotion of Claire Hotvedt to the position of Product Development Specialist. She is based at the company’s

Two of Indium Corporation’s experts will present on high-reliability materials and process optimization at the Eletrain Advanced Packaging and High-Reliability Seminar on December 12 in

Indium Corporation will feature an innovative alloy and solder flux pairing that provides high-reliability and enhanced-performance capabilities at IPC APEX Expo February 4-6, in San Diego,

Indium Corporation will feature its new high-performance, high-reliability alloy technology at IPC APEX Expo, February 4-6, in San Diego, Calif., USA.Durafuse™ LT is a novel,

Indium Corporation, Utica’s Technology Company®, is proud to announce the promotion of three

Indium Corporation continues to innovate alloy technologies with a new high-performance, high-reliability low-temperature alloy.  Durafuse™ LT is a novel, low-temperature alloy

Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS®, for IGBT assembly at NEPCON Japan, January 15-17, Tokyo, Japan. Uneven solder bondline thickness

Indium Corporation will feature its fine-grade precision die-attach AuSn ribbon at NEPCON Japan, January 15-17 in Tokyo, Japan. AuLTRA™-fine die-attach AuSn ribbon is designed

Two Indium Corporation experts shared their industry expertise at the Minor Metals Trade Association (MMTA) China Minor Metals Conference, November 4-5, Hong Kong, China.

Indium Corporation, a premium materials manufacturer and supplier of electronics assembly materials, and Mycronic, a global leader in dispensing and jet printing equipment, have

Indium Corporation’s Claire Hotvedt, Product Development Specialist, will present at the SMTA Indiana Indesign Product Engineering and Development LCC Symposium,November 19,

Indium Corporation’s industry partners will feature its proven products live on the show floor during Productronica from November 12-15, in Munich, Germany as part of the

Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS®, at Productronica, November 12-15, Munich, Germany. Indium Corporation is redefining solder with

Indium Corporation will feature its new high-performance, high-reliability low-temperature alloy technology at Productronica, November 12-15, Munich, Germany. DurafuseTM LT is a novel,

Indium Corporation’s Kenneth Thum, Senior Technical Support Engineer, will present at IEEE EPTC Singapore 2019, December 4-6, in Singapore. The development of

Indium Corporation will continue to celebrate its 85th anniversary by featuring some of its industry-leading and newest alloys at Productronica, November 12-15, in Munich, Germany.

Indium Corporation has released TACFlux® 108HF, a new no-clean, halogen-free, high tack force flux for hand soldering and rework applications.   TACFlux® 108HF is

Indium Corporation will show customers how to Avoid the Void® with its void-reducing Indium8.9HF Solder Paste series at CEIA Xiamen on November 7 in Xiamen, China.