Communiqués de presse

Indium Corporation, Utica's Technology Company®, is now accepting applications for the company's college Internship Program. The following paid, full-time positions are open for

Indium Corporation's new Indium10.8HF is a halogen-free, no-clean solder paste that is formulated to provide industry-leading non-wet open performance on large, high IO electronic

Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, will present a two-part workshop at SMT Hybrid Packaging 2016, on April 26-28 in Nuremberg, Germany. Dr.

Indium Corporation, Utica’s Technology Company®, announces the promotions of Theresa Schachtler to Supervisor of Sales Administration and Lisa Clark to Inside Sales Supervisor. Schachtler

Manufacturers no longer have to settle for unacceptable levels of voiding when soldering QFNs, CSPs, or BGAs. Indium Corporation will help customers Avoid the Void™ with its void-reducing

Indium Corporation has been named winner of the annual CIRCUITS ASSEMBLY Service Excellence Award for Materials at IPC APEX Expo on March 15 in Las Vegas,

Indium Corporation will be running its low-voiding solder products “Live@APEX” in partner booths throughout IPC APEX Expo on March 15-17 in Las Vegas, Nev.

Indium Corporation's Sze Pei Lim, Semiconductor Product Manager for Asia, will present at SEMICON China on March 14, 2016, in Shanghai, China. Lim’s

Indium Corporation announces the promotions of Sze Pei Lim to Regional Product Manager for Semiconductor Products in Asia and Jonas Sjoberg to Technical Manager for Asia. Lim

Indium Corporation’s Wolfgang Bloching, Regional Sales Manager – Germany, Austria, and Switzerland, will present at the EPP Innovations Forum on March 10 in Böblingen,

Indium Corporation announces the release of PoP Flux 89LV-P, a bright pink-colored, no-clean, thixotropic flux that helps engineers to Avoid the Void™ by greatly improving visual

Indium Corporation will feature "Power-Safe" NC-SMQ®75, the world's first and only die-attach solder paste suitable for use in non-cleaned clip bond applications in power

Indium Corporation will feature Indium3.2HF water-soluble solder paste at Productronica China on March 15-17, 2016, at the Shanghai New International Expo Centre in Shanghai, China. Indium3.2HF is an

Indium Corporation's Vice President of Technology, Dr. Ning-Cheng Lee, will present at the IPC APEX Expo technical conference on March 13-17 in Las Vegas, Nev. Dr. Lee will give his

Indium Corporation's Indium8.9HF is a halogen-free, no-clean solder paste that is specifically formulated to Avoid the Void®, while delivering high transfer efficiency with low

Indium Corporation will feature Heat-Spring®, a compressible, recyclable, metal thermal interface material, at Strategies in Light on March 1-3 in Santa Clara, Calif. Indium

Indium Corporation will feature its void-reducing no-clean solder pastes to help customers Avoid the Void™ at IPC APEX Expo, which will be held on March 15-17 in Las Vegas,

Indium Corporation, Utica's Technology Company™, has named Derrick Herron, Christopher Nash, Raymond Luo, and Andy Wei the winners of the 2015 Silver Quill Award.

Indium Corporation’s Brandon Judd, Technical Support Engineer, will present at the Surface Mount Technology Association (SMTA) Rocky Mountain chapter meeting on Jan. 26 at the Mile High Stadium

Indium Corporation will feature precision gold-tin (AuSn) solder preforms for die-attach at AeroDef 2016, Feb. 8-10, in Long Beach, Calif. AuSn preforms are designed for high-reliability

Indium Corporation will feature its reinforced indium and solder alloy fabrications InFORMS® at NEPCON Japan, Jan. 13-15 in Tokyo, Japan. InFORMS® are