Communiqués de presse

Indium Corporation will feature its void-reducing no-clean solder pastes to help customers Avoid the Void™ at IPC APEX Expo, which will be held on March 15-17 in Las Vegas,

Indium Corporation, Utica's Technology Company™, has named Derrick Herron, Christopher Nash, Raymond Luo, and Andy Wei the winners of the 2015 Silver Quill Award.

Indium Corporation’s Brandon Judd, Technical Support Engineer, will present at the Surface Mount Technology Association (SMTA) Rocky Mountain chapter meeting on Jan. 26 at the Mile High Stadium

Indium Corporation will feature precision gold-tin (AuSn) solder preforms for die-attach at AeroDef 2016, Feb. 8-10, in Long Beach, Calif. AuSn preforms are designed for high-reliability

Indium Corporation will feature its reinforced indium and solder alloy fabrications InFORMS® at NEPCON Japan, Jan. 13-15 in Tokyo, Japan. InFORMS® are

Since October, Pathways in Technology Early College High School (P-TECH) Oneida-Herkimer-Madison (OHM) BOCES students have analyzed, brainstormed, and designed a real-world product packaging solution

Indium Corporation was presented with the Global Technology Award for Best Products – Americas for InFORMS® high-reliability solder preforms, on Nov. 10 at Productronica in

Indium Corporation's EZ-Pour® Gallium Trichloride (GaCl3) simplifies the use of gallium trichloride by allowing the user to easily transfer the product from one container to

Indium Corporation presented its suite of void-reducing solder pastes, including halogen-free, no-clean Indium8.9HF, at Productronica 2015, Nov. 10-13, in Munich, Germany.  Indium8.9HF is

Indium Corporation announces the addition of Donna Vareha-Walsh as Director, Metals Unit. Vareha-Walsh brings extensive metals market experience from her previous roles, including Director of

Indium Corporation announces the release of its newest informational video that describes how solder preforms can reduce voiding in bottom termination components. This brief video, which can be

Indium Corporation celebrated National Manufacturing Day with more than 60 other exhibitors at the SUNY Poly Manufacturing Day Expo on Oct. 16 at SUNY Polytechnic University, Marcy,

Indium Corporation announces the release of its newest informational video that provides real-world examples of how solder materials performance affects electronics manufacturing productivity

Indium Corporation will feature void-reducing Indium8.9HF, a halogen-free, no-clean solder paste, at Productronica 2015, Nov. 10-13, in Munich, Germany.  Indium8.9HF is

Indium Corporation announces the release of its newest informational video detailing the benefits of using low-temperature solder alloy systems based on indium and

Indium Corporation announces the release of its newest informational video that guides the audience on the proper steps for selecting a solder preform. This brief video features Indium

Indium Corporation announces the release of its newest informational video that discusses InFORMS®, a revolutionary product designed to achieve uniform bondline thickness for a stronger

Indium Corporation announces the release of its newest informational video that provides real-world examples of drastic improvements of electronics manufacturing uptime and productivity. This

Indium Corporation's Tim Jensen, Senior Product Manager for Engineered Solders, will lead a professional development course at the IMAPS 48th annual International Symposium on

Indium Corporation announces a soft metal alloy thermal interface material (SMA TIM) that offers high and uniform thermal resistance at lower applied stresses in compressed interfaces. The

Indium Corporation's full line of inorganic compounds addresses numerous applications and demands. The company's offerings include indium oxide, indium-tin oxide, indium trichloride,