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New StencilCoach Add In to Calculate Apertures to Minimize Solder Balling

Folks, The creation of solder balls, when assembling passive discrete components, has been an issue for decades (see Figure 1). The discovery that the “home plate” stencil aperture design

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Mastering Solder Preform Technology With Low Temperature Solder Alloy Solutions

Achieving efficiency, reliability, and exceptional thermal performance is crucial in package-attach soldering applications for power modules. However, the high reflow temperatures required by