When the firsthigh-volume, automated, die-bonding machines for laser diode assembly were created, a single supplier dominated the market, providing all the solder materialneeded for this application. Generally used for manufacturing optical diode components in wireless communication and automotive applications, these die-bonding machines required a specific type of solder: 80Au20Sn ribbon < 0.1” wide. Furthermore, the ribbon needed to be packaged in longcontinuous lengths suitable for high volume manufacturing. When companies using this new technology began to branch out in search ofnew suppliers, Indium Corporation saw an opportunity to develop a superior product and enter this exciting regional market.
Per questi sistemi di alimentazione automatica, la precisione e la qualità del nastro e della bobina sono della massima importanza, insieme a lunghezze elevate e continue. Queste caratteristiche contribuiscono a ridurre al minimo i tempi di inattività della produzione e a facilitare un processo efficiente e ad alta produttività, che si traduce in un prodotto finale di alta qualità e in un basso costo di proprietà.
With investment and process improvement, Indium Corporation developed our AuLTRA™ Fine Ribbon! This is < 0.1” wide fine-grade, precision ribbon for high volume, fully automated laser diode assembly processes down to 0.010” width and 0.0006” thick capabilities. Our high quality, precision AuLTRA™ Fine Ribbon is designed for high volume production and is packaged on precision spools suitable for auto-feed systems. AuLTRA™ Fine Ribbon is available now in a broad range of sizes, with 15+ meters length per spool capabilities.
Per qualsiasi domanda o per ulteriori informazioni sul nostro nastro AuLTRA™ Fine, contattatemi all'indirizzo [email protected].
