Indium Corporation’s Alvin Zhang, Area Technical Manager – Central China, presented at the IPC Xi'an Technology Seminar on May 20 in Xi’an, China.
Zhang’s presentation discussed how Indium Corporation’s BiAgX® solder paste technology serves as a high-melting, lead-free (Pb-free) drop-in replacement for high-Pb solders used in power semiconductor assembly. Specifically, his paper covered high-reliability die-attach soldering and electronics assembly applications. His presentation included reliability data, customer experiences, and more.
Zhang provides technical support for Indium Corporation’s electronics assembly materials, semiconductor and advanced assembly materials, engineered solders, and thermal management materials for customers in central China. He has more than eight years of experience in semiconductor assembly and technical training. Zhang earned his bachelor’s degree from the University of Electronic Science and Technology of China.
IPC is a global trade association dedicated to furthering the competitive excellence and financial success of its electronics industry members. For more information about upcoming presentations, visit www.ipc.org.cn/Events/Technology-Seminar/2015.
Indium Corporation è uno dei principali produttori e fornitori di materiali per i mercati globali dell'elettronica, dei semiconduttori, del solare, dei film sottili e della gestione termica. I prodotti includono saldature e flussanti, brasature, materiali per interfacce termiche, bersagli per sputtering, metalli e composti inorganici di indio, gallio, germanio e stagno e NanoFoil®. Fondata nel 1934, Indium dispone di un'assistenza tecnica globale e di stabilimenti situati in Cina, Malesia, Singapore, Corea del Sud, Regno Unito e Stati Uniti.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
