Indium Corporation’s Alvin Zhang, Area Technical Manager – Central China, presented at the IPC Xi'an Technology Seminar on May 20 in Xi’an, China.
Zhang’s presentation discussed how Indium Corporation’s BiAgX® solder paste technology serves as a high-melting, lead-free (Pb-free) drop-in replacement for high-Pb solders used in power semiconductor assembly. Specifically, his paper covered high-reliability die-attach soldering and electronics assembly applications. His presentation included reliability data, customer experiences, and more.
Zhang provides technical support for Indium Corporation’s electronics assembly materials, semiconductor and advanced assembly materials, engineered solders, and thermal management materials for customers in central China. He has more than eight years of experience in semiconductor assembly and technical training. Zhang earned his bachelor’s degree from the University of Electronic Science and Technology of China.
IPC is a global trade association dedicated to furthering the competitive excellence and financial success of its electronics industry members. For more information about upcoming presentations, visit www.ipc.org.cn/Events/Technology-Seminar/2015.
インジウム・コーポレーションは、世界のエレクトロニクス、半導体、太陽電池、薄膜、熱管理市場に材料を供給する一流メーカーです。製品には、はんだおよびフラックス、ろう材、熱界面材料、スパッタリングターゲット、インジウム、ガリウム、ゲルマニウム、スズの金属および無機化合物、NanoFoil®などがあります。1934年に設立されたインジウムは、グローバルな技術サポートと中国、マレーシア、シンガポール、韓国、英国、米国に工場を有しています。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
