Indium Corporation’s Alvin Zhang, Area Technical Manager – Central China, presented at the IPC Xi'an Technology Seminar on May 20 in Xi’an, China.
Zhang’s presentation discussed how Indium Corporation’s BiAgX® solder paste technology serves as a high-melting, lead-free (Pb-free) drop-in replacement for high-Pb solders used in power semiconductor assembly. Specifically, his paper covered high-reliability die-attach soldering and electronics assembly applications. His presentation included reliability data, customer experiences, and more.
Zhang provides technical support for Indium Corporation’s electronics assembly materials, semiconductor and advanced assembly materials, engineered solders, and thermal management materials for customers in central China. He has more than eight years of experience in semiconductor assembly and technical training. Zhang earned his bachelor’s degree from the University of Electronic Science and Technology of China.
IPC is a global trade association dedicated to furthering the competitive excellence and financial success of its electronics industry members. For more information about upcoming presentations, visit www.ipc.org.cn/Events/Technology-Seminar/2015.
Indium Corporation es uno de los principales fabricantes y proveedores de materiales para los mercados mundiales de la electrónica, los semiconductores, la energía solar, la capa fina y la gestión térmica. Sus productos incluyen soldaduras y fundentes; soldaduras fuertes; materiales de interfaz térmica; cátodos para sputtering; metales y compuestos inorgánicos de indio, galio, germanio y estaño; y NanoFoil®. Fundada en 1934, Indium cuenta con asistencia técnica mundial y fábricas en China, Malasia, Singapur, Corea del Sur, Reino Unido y Estados Unidos.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
