Indium Corporation advisor and founder/principal of DS&A LLC, David Saums, will present at TestConX 2019 from March 3-6, in Mesa, Arizona, USA.
Saumswill present Design of a Four-Phase Mechanical Cycling Reliability Test Program and Evaluation Results for TIMs Designed for Semiconductor. The paper, co-authored by Tim Jensen, Product Manager for Engineer Solder Materials, and Ron Hunadi, Market Development Manager, Semiconductor and Advanced Materials, evaluates the durability of selected thermal interface materials (TIMs) under mechanical contact cycling equivalent to semiconductor testing.
If you cannot attend TestConX and want to know more about this topic, please contact Tim Jensen at [email protected] or visit indiumstg.wpenginepowered.com/thermal-interface-materials.
Indium Corporation è uno dei principali produttori e fornitori di materiali per i mercati globali dell'elettronica, dei semiconduttori, dei film sottili e della gestione termica. I prodotti includono saldature e flussanti, brasature, materiali per interfacce termiche, target per sputtering, metalli e composti inorganici di indio, gallio, germanio e stagno e NanoFoil®. Fondata nel 1934, l'azienda dispone di un'assistenza tecnica globale e di stabilimenti situati in Cina, Malesia, Singapore, Corea del Sud, Regno Unito e Stati Uniti.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
