Indium Corporation advisor and founder/principal of DS&A LLC, David Saums, will present at TestConX 2019 from March 3-6, in Mesa, Arizona, USA.
Saumswill present Design of a Four-Phase Mechanical Cycling Reliability Test Program and Evaluation Results for TIMs Designed for Semiconductor. The paper, co-authored by Tim Jensen, Product Manager for Engineer Solder Materials, and Ron Hunadi, Market Development Manager, Semiconductor and Advanced Materials, evaluates the durability of selected thermal interface materials (TIMs) under mechanical contact cycling equivalent to semiconductor testing.
If you cannot attend TestConX and want to know more about this topic, please contact Tim Jensen at [email protected] or visit indiumstg.wpenginepowered.com/thermal-interface-materials.
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊料和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。公司成立於 1934 年，擁有全球性的技術支援，工廠位於中國、馬來西亞、新加坡、南韓、英國和美國。
如需進一步了解 Indium Corporation，請造訪indiumstg.wpenginepowered.com或發送電子郵件至 [email protected]。您也可以在www.facebook.com/indium或@IndiumCorp 追蹤我們的專家團隊「From One Engineer ToAnother®」（#FOETA）。
