Indium Corporation advisor and founder/principal of DS&A LLC, David Saums, will present at TestConX 2019 from March 3-6, in Mesa, Arizona, USA.
Saumswill present Design of a Four-Phase Mechanical Cycling Reliability Test Program and Evaluation Results for TIMs Designed for Semiconductor. The paper, co-authored by Tim Jensen, Product Manager for Engineer Solder Materials, and Ron Hunadi, Market Development Manager, Semiconductor and Advanced Materials, evaluates the durability of selected thermal interface materials (TIMs) under mechanical contact cycling equivalent to semiconductor testing.
If you cannot attend TestConX and want to know more about this topic, please contact Tim Jensen at [email protected] or visit indiumstg.wpenginepowered.com/thermal-interface-materials.
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