Indium Corporation, Utica's Technology Company™, has named Ed Briggs, senior technical support engineer, their 2014 Silver Quill Award winner.
Briggs' technical paper, Meeting Future Stencil Printing Challenges with Ultrafine Powder Solder Pastes, presents a statistical analysis of the transfer efficiency of a variety of solder powder particle sizes, specifically types 3, 4, 5, and 6, and reviews observations of post-reflow results in both optimal and harsh conditions.
Briggs, an SMTA-certified process engineer, provides technical support to Indium Corporation's global electronics assembly customers. He earned his Six Sigma Green Belt from Dartmouth College and has an associate degree in chemical technology from Mohawk Valley Community College where he received the Douglas J. Bauer Award for Excellence in Chemistry. Briggs joined Indium Corporation in 1990 and has held a variety of positions in operations and technical support.
Brigg's award-winning paper can be downloaded at www.indium.us/D1152.
Indium Corporation's Silver Quill Award program encourages individuals to author world-class technical reports, presentations, articles, and books. It then honors the most effective works based on their relevance and impact on the industry.
Indium Corporation è uno dei principali produttori e fornitori di materiali per i mercati globali dell'elettronica, dei semiconduttori, del solare, dei film sottili e della gestione termica. I prodotti includono saldature e flussanti, brasature, materiali per interfacce termiche, bersagli per sputtering, metalli e composti inorganici di indio, gallio, germanio e stagno e NanoFoil®. Fondata nel 1934, Indium dispone di un'assistenza tecnica globale e di stabilimenti situati in Cina, Malesia, Singapore, Corea del Sud, Regno Unito e Stati Uniti.
Per ulteriori informazioni su Indium Corporation, visitare il sito www.indium.com o inviare un'e-mail a [email protected]. È inoltre possibile seguire i nostri esperti From One Engineer To Another® (#FOETA) su www.facebook.com/indium o @IndiumCorp.
