Indium Corporation, Utica's Technology Company™, has named Ed Briggs, senior technical support engineer, their 2014 Silver Quill Award winner.
Briggs' technical paper, Meeting Future Stencil Printing Challenges with Ultrafine Powder Solder Pastes, presents a statistical analysis of the transfer efficiency of a variety of solder powder particle sizes, specifically types 3, 4, 5, and 6, and reviews observations of post-reflow results in both optimal and harsh conditions.
Briggs, an SMTA-certified process engineer, provides technical support to Indium Corporation's global electronics assembly customers. He earned his Six Sigma Green Belt from Dartmouth College and has an associate degree in chemical technology from Mohawk Valley Community College where he received the Douglas J. Bauer Award for Excellence in Chemistry. Briggs joined Indium Corporation in 1990 and has held a variety of positions in operations and technical support.
Brigg's award-winning paper can be downloaded at www.indium.us/D1152.
Indium Corporation's Silver Quill Award program encourages individuals to author world-class technical reports, presentations, articles, and books. It then honors the most effective works based on their relevance and impact on the industry.
铟泰公司 面向全球电子、半导体、太阳能、薄膜及热管理 顶级材料制造商和供应商。 产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡的金属及化合物；以及NanoFoil®。铟泰公司成立于1934年，拥有全球技术支持体系，并在中国、马来西亚、新加坡、韩国、英国和美国设有工厂。
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