Indium Corporation, Utica's Technology Company™, has named Ed Briggs, senior technical support engineer, their 2014 Silver Quill Award winner.
Briggs' technical paper, Meeting Future Stencil Printing Challenges with Ultrafine Powder Solder Pastes, presents a statistical analysis of the transfer efficiency of a variety of solder powder particle sizes, specifically types 3, 4, 5, and 6, and reviews observations of post-reflow results in both optimal and harsh conditions.
Briggs, an SMTA-certified process engineer, provides technical support to Indium Corporation's global electronics assembly customers. He earned his Six Sigma Green Belt from Dartmouth College and has an associate degree in chemical technology from Mohawk Valley Community College where he received the Douglas J. Bauer Award for Excellence in Chemistry. Briggs joined Indium Corporation in 1990 and has held a variety of positions in operations and technical support.
Brigg's award-winning paper can be downloaded at www.indium.us/D1152.
Indium Corporation's Silver Quill Award program encourages individuals to author world-class technical reports, presentations, articles, and books. It then honors the most effective works based on their relevance and impact on the industry.
インジウム・コーポレーションは、世界のエレクトロニクス、半導体、太陽電池、薄膜、熱管理市場に材料を供給する一流メーカーです。製品には、はんだおよびフラックス、ろう材、熱界面材料、スパッタリングターゲット、インジウム、ガリウム、ゲルマニウム、スズの金属および無機化合物、NanoFoil®などがあります。1934年に設立されたインジウムは、グローバルな技術サポートと中国、マレーシア、シンガポール、韓国、英国、米国に工場を有しています。
インジウム・コーポレーションについての詳細は、www.indium.comをご覧いただくか、[email protected] まで電子メールでお問い合わせください。また、当社の専門家であるFrom One Engineer ToAnother®(#FOETA)を、www.facebook.com/indiumまたは@IndiumCorp でフォローすることもできます。
