Indium Corporation’s Aaron Yan, Area Technical Manager – Eastern China, will present at the IPC Shanghai Technology Seminar on July 17 in Shanghai, China.
Yan’s presentation, High-Temperature Lead-free BiAgX® Material, will discuss BiAgX – a high-melting, lead-free (Pb-free) solder paste technology that is a drop-in replacement for high-Pb solders used in many high-reliability die-attach and electronics assembly applications. Yan will also address how BiAgX is suited for small, low-voltage QFN packages that are used in portable electronics (smartphones/tablets), automotive electronics, and industrial applications.
Yan is responsible for providing technical support for Indium Corporation's electronics assembly materials, semiconductor and advanced assembly materials, engineered solders, and thermal management materials. Yan has more than 12 years of experience in surface mount technology, specializing in defect prevention, continuous quality improvement, and cost reduction.
IPC is a global trade association dedicated to furthering the competitive excellence and financial success of its electronics industry members. For more information about upcoming presentations, visit www.ipc.org.cn/Events/Technology-Seminar/2015.
Indium Corporation è uno dei principali produttori e fornitori di materiali per i mercati globali dell'elettronica, dei semiconduttori, del solare, dei film sottili e della gestione termica. I prodotti includono saldature e flussanti, brasature, materiali per interfacce termiche, bersagli per sputtering, metalli e composti inorganici di indio, gallio, germanio e stagno e NanoFoil®. Fondata nel 1934, Indium dispone di un'assistenza tecnica globale e di stabilimenti situati in Cina, Malesia, Singapore, Corea del Sud, Regno Unito e Stati Uniti.
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