Indium Corporation Expert to Present at IPC Shanghai Technology Seminar

Indium Corporation’s Aaron Yan, Area Technical Manager – Eastern China, will present at the IPC Shanghai Technology Seminar on July 17 in Shanghai, China.

Yan’s presentation, High-Temperature Lead-free BiAgX^® Material, will discuss BiAgX – a high-melting, lead-free (Pb-free) solder paste technology that is a drop-in replacement for high-Pb solders used in many high-reliability die-attach and electronics assembly applications. Yan will also address how BiAgX is suited for small, low-voltage QFN packages that are used in portable electronics (smartphones/tablets), automotive electronics, and industrial applications.

Yan is responsible for providing technical support for Indium Corporation's electronics assembly materials, semiconductor and advanced assembly materials, engineered solders, and thermal management materials. Yan has more than 12 years of experience in surface mount technology, specializing in defect prevention, continuous quality improvement, and cost reduction.

IPC is a global trade association dedicated to furthering the competitive excellence and financial success of its electronics industry members. For more information about upcoming presentations, visit www.ipc.org.cn/Events/Technology-Seminar/2015.

Indium Corporation es uno de los principales fabricantes y proveedores de materiales para los mercados mundiales de la electrónica, los semiconductores, la energía solar, la capa fina y la gestión térmica. Sus productos incluyen soldaduras y fundentes; soldaduras fuertes; materiales de interfaz térmica; cátodos para sputtering; metales y compuestos inorgánicos de indio, galio, germanio y estaño; y ^NanoFoil®. Fundada en 1934, Indium cuenta con asistencia técnica mundial y fábricas en China, Malasia, Singapur, Corea del Sur, Reino Unido y Estados Unidos.

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