Indium Corporation’s Aaron Yan, Area Technical Manager – Eastern China, will present at the IPC Shanghai Technology Seminar on July 17 in Shanghai, China.
Yan’s presentation, High-Temperature Lead-free BiAgX® Material, will discuss BiAgX – a high-melting, lead-free (Pb-free) solder paste technology that is a drop-in replacement for high-Pb solders used in many high-reliability die-attach and electronics assembly applications. Yan will also address how BiAgX is suited for small, low-voltage QFN packages that are used in portable electronics (smartphones/tablets), automotive electronics, and industrial applications.
Yan is responsible for providing technical support for Indium Corporation's electronics assembly materials, semiconductor and advanced assembly materials, engineered solders, and thermal management materials. Yan has more than 12 years of experience in surface mount technology, specializing in defect prevention, continuous quality improvement, and cost reduction.
IPC is a global trade association dedicated to furthering the competitive excellence and financial success of its electronics industry members. For more information about upcoming presentations, visit www.ipc.org.cn/Events/Technology-Seminar/2015.
铟泰公司 面向全球电子、半导体、太阳能、薄膜及热管理 顶级材料制造商和供应商。 产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡的金属及化合物；以及NanoFoil®。铟泰公司成立于1934年，拥有全球技术支持体系，并在中国、马来西亚、新加坡、韩国、英国和美国设有工厂。
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