Indium Corporation expert Andreas Karch, Regional Technical Manager, Germany, Austria, and Switzerland, will present at the ITW EAE Smart Stencil Printing Solutions seminar, October 23-24, in Dreieich, Germany.
Karch’s presentation, Voiding and How to Optimize Current Printing Processes, will examine the evolution of solder paste for the elimination of voiding. He will also discuss stencil design, specifications, and other printing tips and tricks to help engineers optimize their processes.
As a Regional Technical Manager, Karch provides support, including sharing process knowledge and making technical recommendations, for the use of Indium Corporation’s solder paste, solder preforms, fluxes, and thermal management materials. He has more than 20 years of automotive industry experience in PCB assembly and power electronics, including the advanced development of customized electronics. Karch is an ECQA-certified integrated design engineer and has earned his Six Sigma Yellow Belt. He received an award for developing one of the top 10 innovative patents for automotive LED assembly. Karch maintains a thorough understanding of process technologies and project management skills.
Indium Corporation è uno dei principali produttori e fornitori di materiali per i mercati globali dell'elettronica, dei semiconduttori, dei film sottili e della gestione termica. I prodotti includono saldature e flussanti, brasature, materiali per interfacce termiche, target per sputtering, metalli e composti inorganici di indio, gallio, germanio e stagno e NanoFoil®. Fondata nel 1934, l'azienda dispone di un'assistenza tecnica globale e di stabilimenti situati in Cina, India, Malesia, Singapore, Corea del Sud, Regno Unito e Stati Uniti.
Per ulteriori informazioni su Indium Corporation, visitare il sito www.indium.com o inviare un'e-mail a [email protected]. È inoltre possibile seguire i nostri esperti, From One Engineer To Another® (#FOETA), su www.facebook.com/indium o @IndiumCorp.
