Indium Corporation expert Andreas Karch, Regional Technical Manager, Germany, Austria, and Switzerland, will present at the ITW EAE Smart Stencil Printing Solutions seminar, October 23-24, in Dreieich, Germany.
Karch’s presentation, Voiding and How to Optimize Current Printing Processes, will examine the evolution of solder paste for the elimination of voiding. He will also discuss stencil design, specifications, and other printing tips and tricks to help engineers optimize their processes.
As a Regional Technical Manager, Karch provides support, including sharing process knowledge and making technical recommendations, for the use of Indium Corporation’s solder paste, solder preforms, fluxes, and thermal management materials. He has more than 20 years of automotive industry experience in PCB assembly and power electronics, including the advanced development of customized electronics. Karch is an ECQA-certified integrated design engineer and has earned his Six Sigma Yellow Belt. He received an award for developing one of the top 10 innovative patents for automotive LED assembly. Karch maintains a thorough understanding of process technologies and project management skills.
铟泰公司 面向全球电子、半导体、薄膜及热管理 顶级材料制造商和供应商。产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡的金属及化合物；以及NanoFoil®。公司成立于1934年，拥有全球技术支持网络，并在中国、印度、马来西亚、新加坡、韩国、英国和美国设有工厂。
如需了解铟泰公司更多信息，请访问indiumstg.wpenginepowered.com或发送电子邮件至 [email protected]。您还可以通过www.facebook.com/indium或@IndiumCorp 关注我们的专家团队“From One Engineer ToAnother®”（#FOETA）。
