Indium Corporation expert Andreas Karch, Regional Technical Manager, Germany, Austria, and Switzerland, will present at the ITW EAE Smart Stencil Printing Solutions seminar, October 23-24, in Dreieich, Germany.
Karch’s presentation, Voiding and How to Optimize Current Printing Processes, will examine the evolution of solder paste for the elimination of voiding. He will also discuss stencil design, specifications, and other printing tips and tricks to help engineers optimize their processes.
As a Regional Technical Manager, Karch provides support, including sharing process knowledge and making technical recommendations, for the use of Indium Corporation’s solder paste, solder preforms, fluxes, and thermal management materials. He has more than 20 years of automotive industry experience in PCB assembly and power electronics, including the advanced development of customized electronics. Karch is an ECQA-certified integrated design engineer and has earned his Six Sigma Yellow Belt. He received an award for developing one of the top 10 innovative patents for automotive LED assembly. Karch maintains a thorough understanding of process technologies and project management skills.
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物以及 NanoFoil®。公司成立於 1934 年，擁有全球性的技術支援，工廠位於中國、印度、馬來西亞、新加坡、南韓、英國和美國。
如需更多關於 Indium Corporation 的資訊，請造訪www.indium.com或寄電子郵件至 [email protected]。您也可以透過www.facebook.com/indium或@IndiumCorp 追蹤我們的專家，From One Engineer ToAnother®(#FOETA)。
