Indium Corporation’s Maria Durham, Technical Support Engineer for Semiconductor and Advanced Assembly Materials, will co-chair a technical session at the International Microelectronics Assembly and Packaging Society (IMAPS) New England Chapter 2016 Symposium and Expo on May 3 in Boxborough, Mass.
The session, Advanced Technologies for 2.5D/3D Packaging, will discuss the impact of high-density 3D packages, other aspects of 2.5D/3D integration technology and applications, and copper pillar and underfill challenges.
Durham serves as a technical liaison between Indium Corporation’s customers and internal departments, such as sales, technical support, research and development, and operations to guarantee the best quality and selection of products. She earned her bachelor’s degree in physics and applied mathematics from Clarkson University in Potsdam, N.Y.
IMAPS is a global community of microelectronic related engineers, scientists, manufacturers, end-users, and supply chain companies. The Society aims to support the development and growth of the microelectronics and related industries, and to aid the transfer of knowledge and information.
Indium Corporation è uno dei principali produttori e fornitori di materiali per i mercati globali dell'elettronica, dei semiconduttori, dei film sottili, della gestione termica e del solare. I prodotti includono saldature e flussanti, brasature, materiali per interfacce termiche, bersagli per sputtering, metalli e composti inorganici di indio, gallio, germanio e stagno e NanoFoil®. Fondata nel 1934, Indium dispone di un'assistenza tecnica globale e di stabilimenti situati in Cina, Malesia, Singapore, Corea del Sud, Regno Unito e Stati Uniti.
Per ulteriori informazioni su Indium Corporation, visitare il sito www.indium.com o inviare un'e-mail a [email protected]. È inoltre possibile seguire i nostri esperti, From One Engineer To Another® (#FOETA), su www.facebook.com/indium o @IndiumCorp.
