Indium Corporation’s Maria Durham, Technical Support Engineer for Semiconductor and Advanced Assembly Materials, will co-chair a technical session at the International Microelectronics Assembly and Packaging Society (IMAPS) New England Chapter 2016 Symposium and Expo on May 3 in Boxborough, Mass.
The session, Advanced Technologies for 2.5D/3D Packaging, will discuss the impact of high-density 3D packages, other aspects of 2.5D/3D integration technology and applications, and copper pillar and underfill challenges.
Durham serves as a technical liaison between Indium Corporation’s customers and internal departments, such as sales, technical support, research and development, and operations to guarantee the best quality and selection of products. She earned her bachelor’s degree in physics and applied mathematics from Clarkson University in Potsdam, N.Y.
IMAPS是一個由微電子相關工程師、科學家、製造商、終端使用者及供應鏈企業所組成的全球性社群。本學會旨在支持微電子及相關產業的發展與成長，並促進知識與資訊的交流。
Indium Corporation 是全球電子、半導體、薄膜、熱管理和太陽能市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。Indium 成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、馬來西亞、新加坡、南韓、英國和美國。
如需進一步了解 Indium Corporation，請造訪indiumstg.wpenginepowered.com或發送電子郵件至 [email protected]。您也可以在www.facebook.com/indium或@IndiumCorp 追蹤我們的專家團隊「From One Engineer ToAnother®」（#FOETA）。
