Indium Corporation‘s Brian Huang, Area Technical Manager for South China, will be presenting at IPC Works Asia 2010, October 26 – 27, 2010, in Shenzhen, China.
Brian’s paper, Establishing a Precision Stencil Printing Process for Miniaturized Electronics Assembly, discusses optimization techniques employed to establish precision SMT printing processes. These techniques are in response to the need to assemble the smaller and smaller components used in miniaturized electronics for mobile phones and other portable devices.
Brian has over five years of experience in SMT process and electronics equipment. He has a master’s degree in Material Physics and Chemistry from Xiamen University. Brian has also earned his certification as a Six-Sigma Green Belt.
Indium Corporation è uno dei principali fornitori di materiali per i mercati globali dell'elettronica, dei semiconduttori, del solare, dei film sottili e della gestione termica. I prodotti comprendono saldature, preforme e flussanti; brasature; bersagli sputter; prodotti chimici e approvvigionamento di indio, gallio e germanio e Reactive NanoFoil®. Fondata nel 1934, Indium dispone di un'assistenza tecnica globale e di stabilimenti situati in Cina, Singapore, Corea del Sud, Regno Unito e Stati Uniti.
For more information about IPC or to register for this conference, visit http://www.ipc.org.
Per ulteriori informazioni su Indium Corporation, visitare il sito www.indium.com o inviare un'e-mail a [email protected].
