Indium Corporation‘s Brian Huang, Area Technical Manager for South China, will be presenting at IPC Works Asia 2010, October 26 – 27, 2010, in Shenzhen, China.
Brian’s paper, Establishing a Precision Stencil Printing Process for Miniaturized Electronics Assembly, discusses optimization techniques employed to establish precision SMT printing processes. These techniques are in response to the need to assemble the smaller and smaller components used in miniaturized electronics for mobile phones and other portable devices.
Brian has over five years of experience in SMT process and electronics equipment. He has a master’s degree in Material Physics and Chemistry from Xiamen University. Brian has also earned his certification as a Six-Sigma Green Belt.
Indium Corporation 是全球電子、半導體、太陽能、薄膜和熱管理市場的主要材料供應商。產品包括焊料、預成型 品和助熔劑；钎料；濺鍍靶材；铟、鎵和锗化學品和採購；以及 Reactive NanoFoil®。Indium 成立於 1934 年，擁有全球性的技術支援，工廠位於中國、新加坡、南韓、英國和美國。
For more information about IPC or to register for this conference, visit http://www.ipc.org.
如需有關 Indium Corporation 的更多資訊，請造訪www.indium.com或發送電子郵件至 [email protected]。
