Indium Corporation will feature its high-reliability, Au-based precision die-attach (PDA) preforms for critical laser and RF applications at the International Microwave Symposium, Denver, Colo., June 1924.
Indium Corporation is the leading solder supplier for laser, optical, and RF microwave applications. Au-based alloys are a great choice to ensure the best performance and reliability possible for applications requiring a high-melting die-attach solder. In addition to meeting the demanding thermal and electrical requirements for high-reliability applications, they also provide the strongest corrosion- and oxidation-resistant solder joint possible. Semiconductor laser and RF power die-attach applications require the highest quality, ultraprecise solder preforms to ensure accuracy and repeatability during assembly for a guaranteed highly-reliable end product. Indium Corporation’s Au-based PDA preforms offer the highest level of quality available to deliver the best performance possible in critical, high-reliability die-attach applications. Features include:
- Controllo dello spessore altamente accurato
- Qualità dei bordi di precisione, praticamente senza bave
- Controllo ottimizzato della pulizia
- Metodo predefinito per il waffle-pack
Indium Corporation’s AuLTRA 75 is an off-eutectic AuSn preform solution (75Au25Sn) designed to improve intermetallic reliability in applications using a die with a thicker gold plating, such as a GaN die used for high-frequency, high-power RF power amplifier devices for 5G and other critical military and aerospace wireless communications. AuLTRA 75 helps improve the operation of these critical technologies by offering a lower gold content, allowing for the absorption of gold from the die, and thereby ensuring a strong solder bond.
AuSn preform solutions:
- Deliver improved wetting and voiding
- Allow for adjustment of the final solder joint composition
- Are available in 78Au22Sn and 79Au21Sn formulations
Indium Corporation AuLTRA ThInFORMS are 0.00035″ thick (0.00889mm or 8.89m) 80Au20Sn preforms that improve the overall operational efficiency of high-output lasers. AuLTRA ThInFORMS help combat common issues such as:
- Cortocircuito Il volume ridotto della saldatura impedisce la risalita della matrice, riducendo al minimo il rischio di cortocircuito.
- Poor thermal transferthe ultra-thin 0.00035″ preform reduces bondline thickness, thus improving thermal transfer and increasing the longevity and performance of the device.
To learn more about Indium Corporation’s precision Au-based preforms, visit www.indium.com/products/solders/gold/gold-preforms or stop by booth #9012 at the show.
Informazioni su Indium Corporation
Indium Corporation è un'azienda leader nella raffinazione, fusione, produzione e fornitura di materiali per i mercati globali dell'elettronica, dei semiconduttori, dei film sottili e della gestione termica. I prodotti includono saldature e flussanti, brasature, materiali per interfacce termiche, bersagli per sputtering, metalli e composti inorganici di indio, gallio, germanio e stagno e NanoFoil. Fondata nel 1934, l'azienda dispone di un'assistenza tecnica globale e di stabilimenti situati in Cina, Germania, India, Malesia, Singapore, Corea del Sud, Regno Unito e Stati Uniti.
Per ulteriori informazioni su Indium Corporation, visitare www.indium.com o inviare un'e-mail a Jingya Huang. È inoltre possibile seguire i nostri esperti, From One Engineer To Another (#FOETA), all'indirizzo www.linkedin.com/company/indium-corporation/ o @IndiumCorp.
Informazioni sul Simposio internazionale sulle microonde
For 70 years, IMS has brought together a unique mix of international RF and microwave experts presenting the latest research and showcasing the newest products and services. IMS includes education and networking opportunities as well as an exhibition. Learn more at ims-ieee.org.
