Indium Corporation will feature its high-reliability, Au-based precision die-attach (PDA) preforms for critical laser and RF applications at the International Microwave Symposium, Denver, Colo., June 1924.
Indium Corporation is the leading solder supplier for laser, optical, and RF microwave applications. Au-based alloys are a great choice to ensure the best performance and reliability possible for applications requiring a high-melting die-attach solder. In addition to meeting the demanding thermal and electrical requirements for high-reliability applications, they also provide the strongest corrosion- and oxidation-resistant solder joint possible. Semiconductor laser and RF power die-attach applications require the highest quality, ultraprecise solder preforms to ensure accuracy and repeatability during assembly for a guaranteed highly-reliable end product. Indium Corporation’s Au-based PDA preforms offer the highest level of quality available to deliver the best performance possible in critical, high-reliability die-attach applications. Features include:
- 매우 정확한 두께 제어
- 버가 거의 없는 정밀한 엣지 품질
- 최적화된 청결도 관리
- 기본 와플팩 방식
Indium Corporation’s AuLTRA 75 is an off-eutectic AuSn preform solution (75Au25Sn) designed to improve intermetallic reliability in applications using a die with a thicker gold plating, such as a GaN die used for high-frequency, high-power RF power amplifier devices for 5G and other critical military and aerospace wireless communications. AuLTRA 75 helps improve the operation of these critical technologies by offering a lower gold content, allowing for the absorption of gold from the die, and thereby ensuring a strong solder bond.
AuSn preform solutions:
- Deliver improved wetting and voiding
- Allow for adjustment of the final solder joint composition
- Are available in 78Au22Sn and 79Au21Sn formulations
Indium Corporation AuLTRA ThInFORMS are 0.00035″ thick (0.00889mm or 8.89m) 80Au20Sn preforms that improve the overall operational efficiency of high-output lasers. AuLTRA ThInFORMS help combat common issues such as:
- 솔더 부피 감소로 다이의 위킹을 억제하여 단락 위험 최소화
- Poor thermal transferthe ultra-thin 0.00035″ preform reduces bondline thickness, thus improving thermal transfer and increasing the longevity and performance of the device.
To learn more about Indium Corporation’s precision Au-based preforms, visit www.indium.com/products/solders/gold/gold-preforms or stop by booth #9012 at the show.
인디엄 코퍼레이션 소개
Indium Corporation 은 전 세계 전자, 반도체, 박막 및 열 관리 시장에 최고의 소재 정제, 제련, 제조 및 공급업체입니다. 제품에는 솔더 및 플럭스, 브레이즈, 열 인터페이스 재료, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄, 주석 금속 및 무기 화합물, NanoFoil 이 포함됩니다. 1934년에 설립된 이 회사는 중국, 독일, 인도, 말레이시아, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
인디움 코퍼레이션에 대한 자세한 정보는 www.indium.com 또는 징야 황에게 이메일을 보내주세요. 또한 From One Engineer To Another (#FOETA)의 전문가를 www.linkedin.com/company/indium-corporation/ 또는 @IndiumCorp에서 팔로우할 수도 있습니다.
국제 마이크로파 심포지엄 정보
For 70 years, IMS has brought together a unique mix of international RF and microwave experts presenting the latest research and showcasing the newest products and services. IMS includes education and networking opportunities as well as an exhibition. Learn more at ims-ieee.org.
