Indium Corporation will feature its high-reliability, Au-based precision die-attach (PDA) preforms for critical laser and RF applications at the International Microwave Symposium, Denver, Colo., June 1924.
Indium Corporation is the leading solder supplier for laser, optical, and RF microwave applications. Au-based alloys are a great choice to ensure the best performance and reliability possible for applications requiring a high-melting die-attach solder. In addition to meeting the demanding thermal and electrical requirements for high-reliability applications, they also provide the strongest corrosion- and oxidation-resistant solder joint possible. Semiconductor laser and RF power die-attach applications require the highest quality, ultraprecise solder preforms to ensure accuracy and repeatability during assembly for a guaranteed highly-reliable end product. Indium Corporation’s Au-based PDA preforms offer the highest level of quality available to deliver the best performance possible in critical, high-reliability die-attach applications. Features include:
- 高度精确的厚度控制
- 边缘质量精确，几乎无毛刺
- 优化清洁度控制
- 默认的华夫饼包装方法
Indium Corporation’s AuLTRA 75 is an off-eutectic AuSn preform solution (75Au25Sn) designed to improve intermetallic reliability in applications using a die with a thicker gold plating, such as a GaN die used for high-frequency, high-power RF power amplifier devices for 5G and other critical military and aerospace wireless communications. AuLTRA 75 helps improve the operation of these critical technologies by offering a lower gold content, allowing for the absorption of gold from the die, and thereby ensuring a strong solder bond.
AuSn preform solutions:
- Deliver improved wetting and voiding
- Allow for adjustment of the final solder joint composition
- Are available in 78Au22Sn and 79Au21Sn formulations
Indium Corporation AuLTRA ThInFORMS are 0.00035″ thick (0.00889mm or 8.89m) 80Au20Sn preforms that improve the overall operational efficiency of high-output lasers. AuLTRA ThInFORMS help combat common issues such as:
- 短路时减少的焊料量可抑制焊料向裸片上淌，最大限度地降低短路风险
- Poor thermal transferthe ultra-thin 0.00035″ preform reduces bondline thickness, thus improving thermal transfer and increasing the longevity and performance of the device.
To learn more about Indium Corporation’s precision Au-based preforms, visit indiumstg.wpenginepowered.com/products/solders/gold/gold-preforms or stop by booth #9012 at the show.
关于铟泰铟泰公司
铟泰公司是全球电子、半导体、薄膜和热管理市场首屈一指的材料精炼商、冶炼商、制造商和供应商。 产品涵盖焊料与助焊剂、硬焊料、热界面材料、溅射靶材、铟、镓、锗、锡等金属及无机化合物，以及NanoFoil™（ ）。公司创立于1934年，拥有全球技术支持体系，工厂遍布中国、德国、印度、马来西亚、新加坡、韩国、英国及美国。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email Jingya Huang. You can also follow our experts, From One Engineer To Another (#FOETA), at www.linkedin.com/company/indium-corporation/ or @IndiumCorp.
关于国际微波研讨会
For 70 years, IMS has brought together a unique mix of international RF and microwave experts presenting the latest research and showcasing the newest products and services. IMS includes education and networking opportunities as well as an exhibition. Learn more at ims-ieee.org.
