Indium Corporation experts will share their knowledge and expertise at NEPCON Vietnam, Oct. 6-8, in Ho Chi Minh City, Vietnam.
Jonas Sjoberg, Technical Manager, will present DfX for High-Density Assemblies, which covers the basic principles and understanding of manufacturability (DfM) and reliability (DfR).
Participants will learn the importance of understanding process and design and how they impact manufacturing yields, reliability, and total cost. Lessons will include real-world case studies, with fundamental consideration and mechanisms of challenges well illustrated.
James Duong, Area Technical Manager, Vietnam, will discuss how to Avoid the Void™. Voiding reduces the electrical conductivity and physical strength of the solder joint and interferes with the component’s thermal management capabilities. Indium Corporation researched this defect extensively and, as a result, created Indium10.1 and Indium8.9HF solder pastes to minimize voiding and increase product reliability.
Indium Corporation è uno dei principali produttori e fornitori di materiali per i mercati globali dell'elettronica, dei semiconduttori, dei film sottili, della gestione termica e del solare. I prodotti includono saldature e flussanti, brasature, materiali per interfacce termiche, bersagli per sputtering, metalli e composti inorganici di indio, gallio, germanio e stagno e NanoFoil®. Fondata nel 1934, Indium dispone di un'assistenza tecnica globale e di stabilimenti situati in Cina, Malesia, Singapore, Corea del Sud, Regno Unito e Stati Uniti.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
