Indium Corporation experts will share their knowledge and expertise at NEPCON Vietnam, Oct. 6-8, in Ho Chi Minh City, Vietnam.
Jonas Sjoberg, Technical Manager, will present DfX for High-Density Assemblies, which covers the basic principles and understanding of manufacturability (DfM) and reliability (DfR).
Participants will learn the importance of understanding process and design and how they impact manufacturing yields, reliability, and total cost. Lessons will include real-world case studies, with fundamental consideration and mechanisms of challenges well illustrated.
James Duong, Area Technical Manager, Vietnam, will discuss how to Avoid the Void™. Voiding reduces the electrical conductivity and physical strength of the solder joint and interferes with the component’s thermal management capabilities. Indium Corporation researched this defect extensively and, as a result, created Indium10.1 and Indium8.9HF solder pastes to minimize voiding and increase product reliability.
铟泰公司 面向全球电子、半导体、薄膜、热管理及太阳能市场的顶级材料制造商和供应商。 产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡的金属及化合物；以及NanoFoil®。铟泰公司成立于1934年，拥有全球技术支持网络，并在中国、马来西亚、新加坡、韩国、英国和美国设有工厂。
如需了解铟泰公司更多信息，请访问indiumstg.wpenginepowered.com或发送电子邮件至 [email protected]。您还可以通过www.facebook.com/indium或@IndiumCorp 关注我们的专家团队“From One Engineer ToAnother®”（#FOETA）。
