Indium Corporation experts will share their knowledge and expertise at NEPCON Vietnam, Oct. 6-8, in Ho Chi Minh City, Vietnam.
Jonas Sjoberg, Technical Manager, will present DfX for High-Density Assemblies, which covers the basic principles and understanding of manufacturability (DfM) and reliability (DfR).
Participants will learn the importance of understanding process and design and how they impact manufacturing yields, reliability, and total cost. Lessons will include real-world case studies, with fundamental consideration and mechanisms of challenges well illustrated.
James Duong, Area Technical Manager, Vietnam, will discuss how to Avoid the Void™. Voiding reduces the electrical conductivity and physical strength of the solder joint and interferes with the component’s thermal management capabilities. Indium Corporation researched this defect extensively and, as a result, created Indium10.1 and Indium8.9HF solder pastes to minimize voiding and increase product reliability.
Indium Corporation 是全球電子、半導體、薄膜、熱管理和太陽能市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。Indium 成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、馬來西亞、新加坡、南韓、英國和美國。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
