Vai al contenuto

Indium Corporation presenterà i materiali innovativi che alimentano la tecnologia AI al SEMICON di Taiwan

As a proven leader in innovative materials solutions for future-forward technologies, Indium Corporation will proudly showcase its heterogeneous integration and assembly (HIA) products and thermal interface materials (TIMs), that are driving AI advancements, at SEMICON Taiwan, September 4-6, in Taipei, Taiwan.

Indium Corporations SiPaste series is specifically designed for fine-feature printing, with fine powders ranging from Type 5 to Type 8. They help Avoid the Void, reduce slumping, and demonstrate consistent superior printing performance. Indium Corporations SiPaste C312HF is a new formulation offering the same excellent printing performance and material stability over time, with the benefit of having an easily cleanable chemistry with semi-aqueous or saponifier technology.

Indium Corporations Heat-Spring solutions, ideal for TIM2 applications, is a compressible, non-reflow metal TIM. These indium-containing TIMs offer superior thermal conductivity over non-metalswith pure indium metal delivering 86W/mK in all planes. Because of its solid metal state, Heat-Spring avoids pump-out and bake-out problems. It also offers a sustainable solution due to Indium Corporations reclaim and recycle program.

The GalliTHERM portfolio of gallium-based liquid metal solutions draws on Indium Corporations more than 60 years of experience manufacturing gallium-based liquid metals. These liquid metal TIMs are designed for both TIM1 and TIM2 applications. Liquid metal TIMs offer:

  • High thermal conductivity for end-product longevity and reliability
  • Low interfacial resistance against most surfaces, ensuring rapid heat dissipation
  • Extraordinary wetting ability on both metallic and non-metallic surfaces

To learn more about how Indium Corporations HIA and TIM products are helping to drive the AI revolution, visit our experts at booth #L0330 at SEMICON Taiwan.

Informazioni su Indium Corporation

Indium Corporation è un'azienda leader nella raffinazione, fusione, produzione e fornitura di materiali per i mercati globali dell'elettronica, dei semiconduttori, dei film sottili e della gestione termica. I prodotti includono saldature e flussanti, brasature, materiali per interfacce termiche, bersagli per sputtering, metalli e composti inorganici di indio, gallio, germanio e stagno e NanoFoil. Fondata nel 1934, l'azienda dispone di un'assistenza tecnica globale e di stabilimenti situati in Cina, Germania, India, Malesia, Singapore, Corea del Sud, Regno Unito e Stati Uniti.

For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email Jingya Huang. You can also follow our experts, From One Engineer To Another (#FOETA), at www.linkedin.com/company/indium-corporation/.