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Indium Corporation präsentiert innovative Materialien für die KI-Technologie auf der SEMICON in Taiwan

As a proven leader in innovative materials solutions for future-forward technologies, Indium Corporation will proudly showcase its heterogeneous integration and assembly (HIA) products and thermal interface materials (TIMs), that are driving AI advancements, at SEMICON Taiwan, September 4-6, in Taipei, Taiwan.

Indium Corporations SiPaste series is specifically designed for fine-feature printing, with fine powders ranging from Type 5 to Type 8. They help Avoid the Void, reduce slumping, and demonstrate consistent superior printing performance. Indium Corporations SiPaste C312HF is a new formulation offering the same excellent printing performance and material stability over time, with the benefit of having an easily cleanable chemistry with semi-aqueous or saponifier technology.

Indium Corporations Heat-Spring solutions, ideal for TIM2 applications, is a compressible, non-reflow metal TIM. These indium-containing TIMs offer superior thermal conductivity over non-metalswith pure indium metal delivering 86W/mK in all planes. Because of its solid metal state, Heat-Spring avoids pump-out and bake-out problems. It also offers a sustainable solution due to Indium Corporations reclaim and recycle program.

The GalliTHERM portfolio of gallium-based liquid metal solutions draws on Indium Corporations more than 60 years of experience manufacturing gallium-based liquid metals. These liquid metal TIMs are designed for both TIM1 and TIM2 applications. Liquid metal TIMs offer:

  • High thermal conductivity for end-product longevity and reliability
  • Low interfacial resistance against most surfaces, ensuring rapid heat dissipation
  • Extraordinary wetting ability on both metallic and non-metallic surfaces

To learn more about how Indium Corporations HIA and TIM products are helping to drive the AI revolution, visit our experts at booth #L0330 at SEMICON Taiwan.

Über Indium Corporation

Indium Corporation ist ein führender Materialveredler, -schmelzer, -hersteller und -lieferant für die weltweiten Elektronik-, Halbleiter-, Dünnschicht- und Wärmemanagementmärkte. Zu den Produkten gehören Lote und Flussmittel, Hartlote, Materialien für thermische Schnittstellen, Sputtertargets, Metalle und anorganische Verbindungen aus Indium, Gallium, Germanium und Zinn sowie NanoFoil. Das 1934 gegründete Unternehmen verfügt über einen weltweiten technischen Support und Fabriken in China, Deutschland, Indien, Malaysia, Singapur, Südkorea, dem Vereinigten Königreich und den Vereinigten Staaten.

For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email Jingya Huang. You can also follow our experts, From One Engineer To Another (#FOETA), at www.linkedin.com/company/indium-corporation/.