Indium Corporation announces the release of Indium10.2HF, a halogen- and Pb-free, no-clean solder paste that is specifically formulated to address in-circuit testing challenges. Indium10.2HF provides low cost-of-ownership to PCB assemblers through all-around balanced performance.
In addition to outstanding print transfer for increased yields, and resistance to head-in-pillow (HIP) and non-wet open (NWO) defects, this no-clean solder paste is ideal for customers who want a clear residue that quickly breaks away after in-circuit testing.
Indium10.2HF also helps to Avoid the Void™ by delivering low voiding in QFNs, BGAs, and CSPs. This solder paste is perfectly suited for a variety of printing applications, even with small components. It also has superior HIP and NWO resistance, slump resistance, and ICT/flying probe testability.
Indium10.2HF solder paste is part of Indium Corporation’s family of high-performance, lead-free, low-voiding, no-clean solder pastes that help manufacturers Avoid the Void™. For more information about Indium10.2HF, email [email protected] or visit indiumstg.wpenginepowered.com.
Indium Corporation è uno dei principali produttori e fornitori di materiali per i mercati globali dell'elettronica, dei semiconduttori, dei film sottili, della gestione termica e del solare. I prodotti includono saldature e flussanti, brasature, materiali per interfacce termiche, bersagli per sputtering, metalli e composti inorganici di indio, gallio, germanio e stagno e NanoFoil®. Fondata nel 1934, Indium dispone di un'assistenza tecnica globale e di stabilimenti situati in Cina, Malesia, Singapore, Corea del Sud, Regno Unito e Stati Uniti.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
