Indium Corporation announces the release of Indium10.2HF, a halogen- and Pb-free, no-clean solder paste that is specifically formulated to address in-circuit testing challenges. Indium10.2HF provides low cost-of-ownership to PCB assemblers through all-around balanced performance.
In addition to outstanding print transfer for increased yields, and resistance to head-in-pillow (HIP) and non-wet open (NWO) defects, this no-clean solder paste is ideal for customers who want a clear residue that quickly breaks away after in-circuit testing.
Indium10.2HF also helps to Avoid the Void™ by delivering low voiding in QFNs, BGAs, and CSPs. This solder paste is perfectly suited for a variety of printing applications, even with small components. It also has superior HIP and NWO resistance, slump resistance, and ICT/flying probe testability.
Indium10.2HF solder paste is part of Indium Corporation’s family of high-performance, lead-free, low-voiding, no-clean solder pastes that help manufacturers Avoid the Void™. For more information about Indium10.2HF, email [email protected] or visit indiumstg.wpenginepowered.com.
Indium Corporation은 전 세계 전자, 반도체, 박막, 열 관리 및 태양광 시장에 최고의 소재를 제조 및 공급하는 기업입니다. 주요 제품으로는 솔더 및 플럭스, 브레이즈, 열 인터페이스 재료, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄, 주석 금속 및 무기 화합물, NanoFoil® 등이 있습니다. 1934년에 설립된 Indium은 중국, 말레이시아, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
