Indium Corporation announces the release of Indium10.2HF, a halogen- and Pb-free, no-clean solder paste that is specifically formulated to address in-circuit testing challenges. Indium10.2HF provides low cost-of-ownership to PCB assemblers through all-around balanced performance.
In addition to outstanding print transfer for increased yields, and resistance to head-in-pillow (HIP) and non-wet open (NWO) defects, this no-clean solder paste is ideal for customers who want a clear residue that quickly breaks away after in-circuit testing.
Indium10.2HF also helps to Avoid the Void™ by delivering low voiding in QFNs, BGAs, and CSPs. This solder paste is perfectly suited for a variety of printing applications, even with small components. It also has superior HIP and NWO resistance, slump resistance, and ICT/flying probe testability.
Indium10.2HF solder paste is part of Indium Corporation’s family of high-performance, lead-free, low-voiding, no-clean solder pastes that help manufacturers Avoid the Void™. For more information about Indium10.2HF, email [email protected] or visit indiumstg.wpenginepowered.com.
Indium Corporation 是全球電子、半導體、薄膜、熱管理和太陽能市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。Indium 成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、馬來西亞、新加坡、南韓、英國和美國。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
