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Indium Corporation®’s Senior Product Specialist Jason Farrell will deliver a technical presentation at the IMAPS Advanced Packaging for Medical Microelectronics Workshop, taking place March

Indium Corporation Technical Support Engineer Carson Burt will deliver a technical presentation at TestConX 2025, taking place March 3-5 in Mesa, Arizona.  The presentation, Solving Warping Issues

Indium Corporation® will feature its high-reliability, Au-based precision die-attach preforms for critical laser and RF applications at SPIE Photonics West, Jan. 28-30, in San Francisco, California.

As one of the leading materials providers in the electronics assembly industry, Indium Corporation® is looking forward to featuring its innovative Durafuse® solder technology at NEPCON Japan,

Indium Corporation Senior Technologist Dr. Ronald Lasky and Senior Product Development Specialist Kevin Brennan will deliver a series of presentations at the Pan Pacific Strategic Electronics

Indium Corporation Senior Area Technical Manager Jason Chou will deliver a technical presentation at NEPCON Japan, on January 22-24, in Tokyo, Japan.  The presentation, High Reliability and

As one of the leading materials providers in the electronics assembly industry, Indium Corporation® is proud to feature its lineup of high-reliability products for power electronics at NEPCON Japan,

Indium Corporation® will feature its high-reliability AuLTRA® MediPro gold solder solutions at MD&M West, taking place February 4-6 in Anaheim, California. AuLTRA® MediPro is a family of

Indium Corporation today announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics

Evans appointed executive chair of board of directors, Berntson named CEO  Indium Corporation®, a leading materials refiner, smelter, manufacturer, and supplier to global electronics,

Indium Corporation is proud to announce its recent achievement of the Excellence in Electronics Assembly Materials Award from Electronics Era, as part of the EE Excellence & Achievers Awards

Indium Corporation Senior Area Technical Manager for East China Leo Hu is scheduled to deliver a presentation on Low-Temperature Solder Material in Semiconductor Packaging Applications at SiP China

Indium Corporation® will feature its high-reliability AuLTRA® MediPro gold solder solutions at MEDevice Silicon Valley, taking place on November 20-21 in Silicon Valley, California. AuLTRA®

Indium Corporation è stata premiata con il Global Technology Award durante la cerimonia di premiazione che si è svolta il 22 ottobre 2024 presso SMTA International a Rosemont, Illinois. L'azienda ha ricevuto il

Indium Corporation is honored to announce that it has been awarded the Edward J. Pawenski Business/Industry Partnership Award by the New York Community College Trustees (NYCCT). The award was

Indium Corporation today announced that InnoJoin GmbH will be the exclusive global sales partner for NanoFoil® in component mounting applications. NanoFoil® is a leading nanotechnology material

In qualità di uno dei principali fornitori di materiali per l'industria dell'assemblaggio dell'elettronica di potenza, gli esperti di Indium Corporation condivideranno la loro visione tecnica e le loro conoscenze su una serie di argomenti relativi al settore.

In qualità di fornitore di materiali leader nel settore dell'assemblaggio elettronico, Indium Corporation è orgogliosa di presentare i suoi prodotti innovativi e le sue presentazioni tecniche all'SMTA International.

Indium Corporation è orgogliosa di annunciare la sua partecipazione alla prossima Conferenza Internazionale sulle Tecnologie di Produzione Elettronica (IEMT), che si terrà dal 16 al 18 ottobre a Penang, in Malesia. Cinque

Indium Corporation, uno dei principali fornitori di materiali per l'industria dell'assemblaggio elettronico, è orgogliosa di presentare la sua tecnologia di saldatura Durafuse, leader del settore, al Battery Show North.

Indium Corporation, uno dei principali fornitori di materiali per l'industria dell'assemblaggio elettronico, è orgogliosa di presentare i suoi prodotti innovativi all'International Symposium on Microelectronics,