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Indium Corporation®’s Senior Product Specialist Jason Farrell will deliver a technical presentation at the IMAPS Advanced Packaging for Medical Microelectronics Workshop, taking place March

Indium Corporation Technical Support Engineer Carson Burt will deliver a technical presentation at TestConX 2025, taking place March 3-5 in Mesa, Arizona.  The presentation, Solving Warping Issues

Indium Corporation® will feature its high-reliability, Au-based precision die-attach preforms for critical laser and RF applications at SPIE Photonics West, Jan. 28-30, in San Francisco, California.

As one of the leading materials providers in the electronics assembly industry, Indium Corporation® is looking forward to featuring its innovative Durafuse® solder technology at NEPCON Japan,

Indium Corporation Senior Technologist Dr. Ronald Lasky and Senior Product Development Specialist Kevin Brennan will deliver a series of presentations at the Pan Pacific Strategic Electronics

Indium Corporation Senior Area Technical Manager Jason Chou will deliver a technical presentation at NEPCON Japan, on January 22-24, in Tokyo, Japan.  The presentation, High Reliability and

As one of the leading materials providers in the electronics assembly industry, Indium Corporation® is proud to feature its lineup of high-reliability products for power electronics at NEPCON Japan,

Indium Corporation® will feature its high-reliability AuLTRA® MediPro gold solder solutions at MD&M West, taking place February 4-6 in Anaheim, California. AuLTRA® MediPro is a family of

Indium Corporation today announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics

Evans appointed executive chair of board of directors, Berntson named CEO  Indium Corporation®, a leading materials refiner, smelter, manufacturer, and supplier to global electronics,

Indium Corporation is proud to announce its recent achievement of the Excellence in Electronics Assembly Materials Award from Electronics Era, as part of the EE Excellence & Achievers Awards

Indium Corporation Senior Area Technical Manager for East China Leo Hu is scheduled to deliver a presentation on Low-Temperature Solder Material in Semiconductor Packaging Applications at SiP China

Indium Corporation® will feature its high-reliability AuLTRA® MediPro gold solder solutions at MEDevice Silicon Valley, taking place on November 20-21 in Silicon Valley, California. AuLTRA®

인디엄 코퍼레이션은 2024년 10월 22일 일리노이주 로즈몬트에서 열린 SMTA 인터내셔널 시상식에서 글로벌 기술상을 수상하는 영예를 안았습니다. 이 회사는

Indium Corporation is honored to announce that it has been awarded the Edward J. Pawenski Business/Industry Partnership Award by the New York Community College Trustees (NYCCT). The award was

Indium Corporation today announced that InnoJoin GmbH will be the exclusive global sales partner for NanoFoil® in component mounting applications. NanoFoil® is a leading nanotechnology material

전력 전자 조립 산업의 선도적인 소재 공급업체 중 하나인 인디엄 코퍼레이션의 전문가들이 다양한 산업 관련 기술 통찰력과 지식을 공유할 예정입니다.

전자 조립 산업의 선도적인 재료 공급업체 중 하나인 Indium Corporation은 SMTA International에서 자사의 혁신적인 제품과 기술 프레젠테이션을 선보이게 된 것을 자랑스럽게 생각합니다.

인디엄 코퍼레이션은 10월 16일부터 18일까지 말레이시아 페낭에서 열리는 국제 전자 제조 기술 컨퍼런스(IEMT)에 참가하게 된 것을 자랑스럽게 발표합니다. 다섯

전자 조립 산업을 선도하는 소재 공급업체 중 하나인 인디엄 코퍼레이션은 배터리 쇼 북에서 업계 최고의 듀라퓨즈 솔더 기술을 선보이게 되어 자랑스럽게 생각합니다.

As one of the leading materials providers to the electronics assembly industry, Indium Corporation is proud to feature its innovative products at the International Symposium on Microelectronics,