新聞稿

Indium Corporation®’s Senior Product Specialist Jason Farrell will deliver a technical presentation at the IMAPS Advanced Packaging for Medical Microelectronics Workshop, taking place March

Indium Corporation Technical Support Engineer Carson Burt will deliver a technical presentation at TestConX 2025, taking place March 3-5 in Mesa, Arizona.  The presentation, Solving Warping Issues

Indium Corporation® will feature its high-reliability, Au-based precision die-attach preforms for critical laser and RF applications at SPIE Photonics West, Jan. 28-30, in San Francisco, California.

As one of the leading materials providers in the electronics assembly industry, Indium Corporation® is looking forward to featuring its innovative Durafuse® solder technology at NEPCON Japan,

Indium Corporation Senior Technologist Dr. Ronald Lasky and Senior Product Development Specialist Kevin Brennan will deliver a series of presentations at the Pan Pacific Strategic Electronics

Indium Corporation Senior Area Technical Manager Jason Chou will deliver a technical presentation at NEPCON Japan, on January 22-24, in Tokyo, Japan.  The presentation, High Reliability and

As one of the leading materials providers in the electronics assembly industry, Indium Corporation® is proud to feature its lineup of high-reliability products for power electronics at NEPCON Japan,

Indium Corporation® will feature its high-reliability AuLTRA® MediPro gold solder solutions at MD&M West, taking place February 4-6 in Anaheim, California. AuLTRA® MediPro is a family of

Indium Corporation today announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics

Evans appointed executive chair of board of directors, Berntson named CEO  Indium Corporation®, a leading materials refiner, smelter, manufacturer, and supplier to global electronics,

Indium Corporation is proud to announce its recent achievement of the Excellence in Electronics Assembly Materials Award from Electronics Era, as part of the EE Excellence & Achievers Awards

Indium Corporation Senior Area Technical Manager for East China Leo Hu is scheduled to deliver a presentation on Low-Temperature Solder Material in Semiconductor Packaging Applications at SiP China

Indium Corporation® will feature its high-reliability AuLTRA® MediPro gold solder solutions at MEDevice Silicon Valley, taking place on November 20-21 in Silicon Valley, California. AuLTRA®

Indium Corporation 於 2024 年 10 月 22 日在美國伊利諾州 Rosemont 的 SMTA International 舉辦的頒獎典禮中榮獲全球技術獎。該公司獲得

Indium Corporation is honored to announce that it has been awarded the Edward J. Pawenski Business/Industry Partnership Award by the New York Community College Trustees (NYCCT). The award was

Indium Corporation today announced that InnoJoin GmbH will be the exclusive global sales partner for NanoFoil® in component mounting applications. NanoFoil® is a leading nanotechnology material

身為電力電子組裝產業的領導材料供應商之一，Indium Corporation 的專家將分享他們對各種產業相關的技術見解與知識。

身為電子組裝產業的領導材料供應商之一，Indium Corporation 很榮幸能在 SMTA International 展出其創新產品與技術報告。

Indium Corporation 很榮幸宣布參加即將於 10 月 16-18 日在馬來西亞檳城舉行的國際電子製造技術研討會 (IEMT)。五

身為電子組裝產業的領先材料供應商之一，Indium Corporation 很榮幸能在 Battery Show North 展出其領先業界的 Durafuse 焊接技術。

As one of the leading materials providers to the electronics assembly industry, Indium Corporation is proud to feature its innovative products at the International Symposium on Microelectronics,